东南亚再分布层材料市场预测至 2030 年 - COVID-19 影响和区域分析 - 按类型(聚酰亚胺 (PI)、聚苯并恶唑 (PBO)、苯并环丁烯 (BCB) 等)和应用(扇出晶圆级封装 (FOWLP) ) 和 2 5D/3D IC 封装 [高带宽存储器 (HBM)、多芯片集成、层叠封装 (FOPOP) 等])

Historic Data: 2020-2021   |   Base Year: 2022   |   Forecast Period: 2023-2030


No. of Pages: 117    |    Report Code: BMIRE00028981    |    Category: Chemicals and Materials

Southeast Asia Redistribution Layer Material Market

东南亚再分布层材料市场预计将从2022年的5451万美元增长到2030年的1.5011亿美元;预计2022年至2030年复合年增长率为13.5%。

市场介绍

半导体制造中的重新分布层 (RDL) 是微处理器、存储芯片和片上系统 (SoC) 设备等先进集成电路 (IC) 中的关键元素。 RDL 负责将信号从芯片核心路由和重新分配到外部引脚以及芯片内不同层之间。通常,RDL 材料是导电材料(例如铜、铝或其合金)的薄膜。铜由于其优异的导电性而被广泛使用。

人工智能系统非常复杂,通常涉及多个芯片、传感器和处理器,它们必须无缝通信才能实时处理和分析数据。对人工智能硬件中改善连接性和信号完整性的需求不断增长。 RDL 材料对于促进高速数据传输和确保人工智能系统中的各个组件协调工作至关重要。随着人工智能应用跨越从医疗保健到自动驾驶汽车等不同行业,对能够保持牢固连接的 RDL 材料的需求变得更加明显。此外,人工智能领域的特点是快速演变和定制。不同行业对人工智能硬件解决方案有独特的要求,需要设计和配置的灵活性。 RDL 材料使制造商能够定制半导体封装以满足这些特定需求。这种定制能力推动了 RDL 材料的采用,使人工智能设备制造商能够创建针对各种应用进行优化的专用硬件。东南亚经济的快速增长和产业发展也带动了人工智能技术的投资增加。这种增长包括智慧城市、自动驾驶汽车和工业 4.0 计划的发展,所有这些都依赖于基于人工智能的工具和设备。随着这些举措的势头增强,对作为半导体封装基础元件的 RDL 材料的需求也随之增长。因此,对基于人工智能的设备和工具不断增长的需求正在促进东南亚再分布层材料市场的增长。上述因素正在推动东南亚再分布层材料市场的增长。

5G应用对高性能、低损耗介电材料的需求推动了研发投资以及多家公司的生产设施,推动了东南亚的再分布层材料市场。台湾占10纳米以下元件逻辑半导体产量的92%。此外,该地区对可持续发展和环境法规的关注促进了环保材料的开发。松下公司和富士胶片控股公司等公司已经推出了可回收和低影响的材料,以符合东南亚的可持续发展目标。此外,汽车行业对半导体的需求不断增加,推动了该地区对再分布层材料的需求。所有这些因素都在推动东南亚再分布层材料市场的增长。

主要细分市场

根据类型,东南亚再分布层材料市场分为聚酰亚胺(PI)、聚苯并恶唑(PBO)、苯并环丁烯(BCB)等。 2022 年,聚酰亚胺 (PI) 细分市场将主导市场,而聚苯并恶唑 (PBO) 细分市场预计将在 2022 年至 2030 年实现最高复合年增长率。聚苯并恶唑 (PBO) 已发展成为用于封装中重新分布层的聚酰亚胺介电材料的升级版应用程序。 PBO 主要用于扇出晶圆级封装应用。 FOWLP 应用中与 RDL 相关的挑战是需要较低的电介质固化温度、低模量、高伸长率以及显着的电绝缘性。 PBO 可确保制造工艺的简化,由于其良好的电气性能和热稳定性,可实现更高的可靠性。此外,PBO 由于提供高光刻性能和低翘曲而逐渐受到关注。与聚酰亚胺相比,PBO 具有较低的耐化学性和耐热性以及较低的粘合强度。此外,它们的保质期和工艺窗口分别更短和更窄。此外,PBO 作为水相容性材料,已变得极具吸引力。

PBO 还可以减小凸块尺寸并提高分辨率,从而增加凸块密度。 HD Microsystems 率先在 TSV 和 FOWLP 等低温固化应用中使用 PBO。 HD Microsystems 开发了一种名为 HD 8940 的光敏 PBO,可在 200°C 下固化。

PBO 近年来在 RDL 应用中变得非常流行,因为它们保留了 PI 同类产品所表现出的大部分物理和机械性能,并且吸湿性也较低。 PBO 所表现出的水性显影特性使其比 PI 更具优势。此外,较高的伸长率以及较低的拉伸模量对东南亚再分布层材料市场中的 PBO 产生了巨大的吸引力。

主要来源和公司< /strong>

在准备这份有关东南亚再分配层材料市场的报告时提到的一些主要和次要来源是付费数据库 (factiva)、出版物、hoovers、投资者演示文稿、时事通讯、证券交易委员会档案、年度报告以及公共领域提供的其他信息。报告中列出的主要公司包括先进半导体工程公司(Advanced Semiconductor Engineering, Inc);安靠科技;富士胶片公司;杜邦公司;英飞凌科技股份公司;恩智浦半导体;三星电子有限公司;信越化学有限公司; SK海力士公司;和江苏长电科技股份有限公司

购买报告的理由

  • 东南亚再分布层材料市场的进步行业趋势,帮助参与者制定有效的长期战略
  • 发达和发展中市场采用的业务增长战略
  • 2020-2030年东南亚重分布层材料市场定量分析
  • 各行业重分布层材料需求预估< /span>
  • 波特的五力分析为东南亚再分布层材料市场提供了 360 度视角
  • 近期发展了解东南亚市场竞争情况和对再分布层材料的需求。
  • 趋势和前景以及驱动和抑制东南亚再分布层材料市场的因素。
  • 通过了解支撑东南亚再分布层材料市场增长商业利益的策略来制定决策过程
  • 东南亚再分布层材料市场市场各个节点的规模
  • 东南亚再分布层材料市场的详细概述和细分以及行业动态
  • 东南亚再分布层材料市场细分

    按类型

    < /h3>
    • 聚酰亚胺 (PI)
    • 聚苯并恶唑 (PBO)
    • 苯并环丁烯 ( BCB)
    • 其他

    按申请

    • 扇出晶圆级封装 (FOWLP)
    • 2 5D/3D IC 封装
    • 高带宽内存 (HBM)
    • 多芯片集成
    • 层叠封装 (FOPOP)
    • 其他

    公司简介

    • 先进半导体工程公司
    • Amkor Technology
    • Fujifilm Corporation
    • 杜邦
    • 英飞凌科技股份公司
    • 恩智浦半导体
    • 三星电子有限公司
    • 信越化学有限公司
    • SK海力士Inc
    • 江苏长电科技股份有限公司


    Southeast Asia Redistribution Layer Material Strategic Insights

    Strategic insights for Southeast Asia Redistribution Layer Material involve closely monitoring industry trends, consumer behaviours, and competitor actions to identify opportunities for growth. By leveraging data analytics, businesses can anticipate market shifts and make informed decisions that align with evolving customer needs. Understanding these dynamics helps companies adjust their strategies proactively, enhance customer engagement, and strengthen their competitive edge. Building strong relationships with stakeholders and staying agile in response to changes ensures long-term success in any market.

    strategic-framework/southeast-asia-redistribution-layer-material-market-strategic-framework.webp
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    Southeast Asia Redistribution Layer Material Report Scope

    Report Attribute Details
    Market size in 2022 US$ 54.51 Million
    Market Size by 2030 US$ 150.11 Million
    Global CAGR (2022 - 2030) 13.5%
    Historical Data 2020-2021
    Forecast period 2023-2030
    Segments Covered By 类型
    • 聚酰亚胺
    • 聚苯并恶唑
    • 苯并环丁烯
    By 应用
    • 扇出型晶圆级封装
    • 25D/3D IC封装
    Regions and Countries Covered 东南亚
    • 东南亚
    Market leaders and key company profiles
  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology
  • Fujifilm Corporation
  • DuPont
  • Infineon Technologies AG
  • NXP Semiconductors
  • Samsung Electronics Co., Ltd
  • Shin-Etsu Chemical Co., Ltd
  • SK Hynix Inc
  • Jiangsu Changjiang Electronics Technology Co., Ltd
  • Get more information on this report

    Southeast Asia Redistribution Layer Material Regional Insights

    The regional scope of Southeast Asia Redistribution Layer Material refers to the geographical area in which a business operates and competes. Understanding regional nuances, such as local consumer preferences, economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved regions or adapting their offerings to meet regional demands. A clear regional focus allows for more effective resource allocation, targeted marketing, and better positioning against local competitors, ultimately driving growth in those specific areas.

    geography/southeast-asia-redistribution-layer-material-market-geography.webp
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The List of Companies - Southeast Asia Redistribution Layer Material Market

  1. Advanced Semiconductor Engineering, Inc
  2. Amkor Technology
  3. Fujifilm Corporation
  4. DuPont
  5. Infineon Technologies AG
  6. NXP Semiconductors
  7. Samsung Electronics Co., Ltd
  8. Shin-Etsu Chemical Co., Ltd
  9. SK Hynix Inc
  10. Jiangsu Changjiang Electronics Technology Co., Ltd
Frequently Asked Questions
How big is the Southeast Asia Redistribution Layer Material Market?

The Southeast Asia Redistribution Layer Material Market is valued at US$ 54.51 Million in 2022, it is projected to reach US$ 150.11 Million by 2030.

What is the CAGR for Southeast Asia Redistribution Layer Material Market by (2022 - 2030)?

As per our report Southeast Asia Redistribution Layer Material Market, the market size is valued at US$ 54.51 Million in 2022, projecting it to reach US$ 150.11 Million by 2030. This translates to a CAGR of approximately 13.5% during the forecast period.

What segments are covered in this report?

The Southeast Asia Redistribution Layer Material Market report typically cover these key segments-

  • 类型 (聚酰亚胺, 聚苯并恶唑, 苯并环丁烯)
  • 应用 (扇出型晶圆级封装, 25D/3D IC封装)
  • What is the historic period, base year, and forecast period taken for Southeast Asia Redistribution Layer Material Market?

    The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Southeast Asia Redistribution Layer Material Market report:

  • Historic Period : 2020-2021
  • Base Year : 2022
  • Forecast Period : 2023-2030
  • Who are the major players in Southeast Asia Redistribution Layer Material Market?

    The Southeast Asia Redistribution Layer Material Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:

  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology
  • Fujifilm Corporation
  • DuPont
  • Infineon Technologies AG
  • NXP Semiconductors
  • Samsung Electronics Co., Ltd
  • Shin-Etsu Chemical Co., Ltd
  • SK Hynix Inc
  • Jiangsu Changjiang Electronics Technology Co., Ltd
  • Who should buy this report?

    The Southeast Asia Redistribution Layer Material Market report is valuable for diverse stakeholders, including:

    • Investors: Provides insights for investment decisions pertaining to market growth, companies, or industry insights. Helps assess market attractiveness and potential returns.
    • Industry Players: Offers competitive intelligence, market sizing, and trend analysis to inform strategic planning, product development, and sales strategies.
    • Suppliers and Manufacturers: Helps understand market demand for components, materials, and services related to concerned industry.
    • Researchers and Consultants: Provides data and analysis for academic research, consulting projects, and market studies.
    • Financial Institutions: Helps assess risks and opportunities associated with financing or investing in the concerned market.

    Essentially, anyone involved in or considering involvement in the Southeast Asia Redistribution Layer Material Market value chain can benefit from the information contained in a comprehensive market report.