
北美嵌入式芯片封装技术市场预测至 2028 年 - COVID-19 影响和按平台(IC 封装基板、刚性板和柔性板)、应用(智能手机和平板电脑、医疗和可穿戴设备、工业设备、安全设备、和其他应用)和工业(消费电子、IT 和电信、汽车、医疗保健和其他行业)
No. of Pages: 130 | Report Code: TIPRE00022132 | Category: Electronics and Semiconductor
No. of Pages: 130 | Report Code: TIPRE00022132 | Category: Electronics and Semiconductor
技术进步导致该地区市场竞争激烈,因为人们的高消费能力吸引了多项技术发展。随着消费电子设备的广泛采用,消费电子行业在该地区蓬勃发展。智能手机、个人电脑、平板电脑、洗衣机、电视机和其他消费电子设备在北美拥有更广泛的用户群。嵌入式芯片封装技术使制造商能够提供小尺寸的电子设备。此外,5G 网络的日益普及为市场参与者创造了利用系统级封装技术进行连接的先进射频模块的绝佳机会。根据爱立信的移动报告,5G网络在北美市场的份额预计将从2020年的4%增长到2026年的80%,而剩下的20%将由4G技术占据。这凸显了电子公司开发新电子设备的机会,这些电子设备包括采用嵌入式芯片封装技术封装的 IC,以满足不断变化的性能要求。对电子设备小型化的需求不断增长以及嵌入式芯片封装技术的不断发展是推动北美嵌入式芯片封装技术市场增长的主要因素。
就 COVID-19 而言,北美高度重视特别是美国受到影响。封锁后,市场对数字设备的需求不断增加。由于对高速互联网服务的良好基础设施支持,北美是采用智能或物联网设备的杰出地区之一。 5G 网络的采用预计将推动封锁后的市场增长。由于产能下降,COVID-19 疫情对制造设施产生了重大影响。由于电子产品的需求保持稳定,有助于市场恢复增长。例如,2020年12月,领先的微处理器制造商高通公司预测,随着5G网络部署的不断增加,5G智能手机的出货量将在2022年翻一番。 5G 智能手机的日益普及正在降低封锁后时期 COVID-19 的影响;在封锁期间,这肯定会阻碍市场增长。
北美嵌入式芯片封装技术市场预计将从2020年的1985.976万美元增长到2028年的8090.435万美元;预计 2021 年至 2028 年复合年增长率为 19.5%。增强智能手机和汽车设备性能的需求不断增长将推动市场增长。嵌入式芯片封装技术在智能手机和个人电脑市场上拥有巨大的机会,可以提供先进的处理器、发射器和其他组件。嵌入式芯片封装技术增强了器件性能并提供了更好的空间利用解决方案。北美的一些市场参与者正在使用嵌入式芯片封装技术开发 IC 和其他组件,而对于其他市场参与者来说,这是创新智能手机和平板电脑新解决方案的绝佳机会。例如,AT&S、SHINKO 和 ASE Group 等市场参与者为智能手机提供嵌入式芯片封装技术。智能手机消费的增长是未来几年市场增长的主要支撑因素。为了抢占领先地位,企业需要开发尺寸紧凑、高性能的新型处理器。同样,汽车应用中嵌入式芯片封装技术需求的增长预计将为北美市场的参与者提供新的增长机会。例如,英飞凌科技股份公司正在为汽车电机控制解决方案提供嵌入式电源 IC。此外,电气化程度的提高和车辆中物联网设备的出现为市场创造了利润丰厚的机会。
从平台来看,2020年北美嵌入式芯片封装技术市场中,IC封装基板细分市场占据最大份额;从应用来看,智能手机和平板电脑细分市场在北美嵌入式芯片封装市场中占有较大份额2020 年技术市场。此外,消费电子领域在 2020 年按行业划分的北美嵌入式芯片封装技术市场中占有较大份额。
准备本北美嵌入式芯片封装技术市场报告时参考的一些主要一手和二手来源包括公司网站、年度报告、财务报告、国家政府文件和统计数据库等。报告中列出的主要公司有 Amkor Technology, Inc.;日月光集团;美国电话电报公司奥地利科技公司系统技术股份公司;藤仓有限公司;通用电气公司;英飞凌科技股份公司;美高森美;施韦泽电子股份公司;新光电气工业有限公司;和台积电
Strategic insights for North America Embedded Die Packaging Technology involve closely monitoring industry trends, consumer behaviours, and competitor actions to identify opportunities for growth. By leveraging data analytics, businesses can anticipate market shifts and make informed decisions that align with evolving customer needs. Understanding these dynamics helps companies adjust their strategies proactively, enhance customer engagement, and strengthen their competitive edge. Building strong relationships with stakeholders and staying agile in response to changes ensures long-term success in any market.
Report Attribute | Details |
---|---|
Market size in 2020 | US$ 19,859.76 thousand |
Market Size by 2028 | US$ 80,904.35 thousand |
Global CAGR (2021 - 2028) | 19.5 % |
Historical Data | 2018-2019 |
Forecast period | 2021-2028 |
Segments Covered |
By 平台
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Regions and Countries Covered | 北美
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Market leaders and key company profiles |
The regional scope of North America Embedded Die Packaging Technology refers to the geographical area in which a business operates and competes. Understanding regional nuances, such as local consumer preferences, economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved regions or adapting their offerings to meet regional demands. A clear regional focus allows for more effective resource allocation, targeted marketing, and better positioning against local competitors, ultimately driving growth in those specific areas.
The North America Embedded Die Packaging Technology Market is valued at US$ 19,859.76 thousand in 2020, it is projected to reach US$ 80,904.35 thousand by 2028.
As per our report North America Embedded Die Packaging Technology Market, the market size is valued at US$ 19,859.76 thousand in 2020, projecting it to reach US$ 80,904.35 thousand by 2028. This translates to a CAGR of approximately 19.5 % during the forecast period.
The North America Embedded Die Packaging Technology Market report typically cover these key segments-
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The North America Embedded Die Packaging Technology Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
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Essentially, anyone involved in or considering involvement in the North America Embedded Die Packaging Technology Market value chain can benefit from the information contained in a comprehensive market report.