
欧洲嵌入式芯片封装技术市场预测至 2028 年 - COVID-19 影响和按平台(IC 封装基板、刚性板和柔性板)、应用(智能手机和平板电脑、医疗和可穿戴设备、工业设备、安全设备和其他应用)和工业(消费电子、IT 和电信、汽车、医疗保健和其他行业)
No. of Pages: 125 | Report Code: TIPRE00022131 | Category: Electronics and Semiconductor
No. of Pages: 125 | Report Code: TIPRE00022131 | Category: Electronics and Semiconductor
先进技术在制造和商业运营中的大力采用正在推动欧洲嵌入式芯片封装市场的发展。以德国为首的汽车行业——由于拥有戴姆勒股份公司、宝马、大众、欧宝和奥迪等著名汽车制造商——是欧洲市场的最大贡献者。根据欧洲汽车制造商协会的数据,2019 年该地区生产了约 1580 万辆乘用车;因此,汽车制造商对其电动汽车生产能力的高投资进一步推动了欧洲市场的增长。该地区对于采用物联网解决方案来提高整体工业产出也抱有积极的前景。除了越来越多地采用先进电子产品之外,欧洲老龄化人口数量的增加也创造了对先进医疗设备的需求。医疗保健行业也在开发和引进创新设备来满足客户需求。物联网和人工智能等先进技术进一步创造了对微电子设备的需求,因此企业也扩大了在欧洲市场的足迹。嵌入式芯片封装技术的不断发展和电子设备小型化需求的不断升级是推动欧洲嵌入式芯片封装技术市场增长的主要因素。
在COVID-19的情况下,欧洲受到的影响尤其严重英国和俄罗斯。由于COVID-19病例数量增加,2020年上半年欧洲市场的嵌入式芯片封装技术也增长缓慢。与亚洲等其他市场相比,欧洲半导体行业的恢复增长速度较慢而美国,由于COVID-19大流行的影响,工业和汽车电子的需求比消费电子产品受到了大幅打击。由于对先进电子设备的需求不断增加,以重启设施、运营、商业场所和交通,封锁后市场出现了健康的增长。
欧洲嵌入式芯片封装技术市场预计将从2020年的968.692万美元增长到2028年的3504.361万美元;预计 2021 年至 2028 年复合年增长率为 17.8%。可穿戴设备和物联网的日益普及预计将推动欧洲嵌入式芯片封装技术市场的发展。在数字化和物联网(IoT)时代,嵌入式芯片封装技术也为消费者提供先进的电子设备。消费者对智能手表和物联网设备的偏好可能会推动欧洲市场的增长。欧洲的一些市场参与者正在为客户推出先进的可穿戴电子产品。智能可穿戴设备的新功能,例如健康监测、活动监测和互联网连接,正在通过嵌入式芯片封装技术得到改进。例如,Apple Watch 4 系列采用嵌入式芯片封装技术来设计基于小外形尺寸的结构。通过嵌入式芯片封装技术在可穿戴设备中采用嵌入式芯片封装技术预计将推动未来几年欧洲市场的增长。此外,基于物联网技术的智能设备的出现,为嵌入式芯片封装技术开辟了广阔空间,可实现智能助手、智能耳戴设备、伴侣机器人、智能摄像头、智能音箱等功能,将带动欧洲嵌入式芯片的发展。封装技术市场。
从平台来看,IC封装基板细分市场占比最大2020年欧洲嵌入式芯片封装技术市场。从应用来看,智能手机和平板电脑领域在2020年欧洲嵌入式芯片封装技术市场中占有较大的市场份额。此外,消费电子领域在欧洲嵌入式芯片封装技术市场中占有较大的份额。 2020年基于行业的嵌入式芯片封装技术市场。
几个主要的一级和二级准备本欧洲嵌入式芯片封装技术市场报告所参考的来源包括公司网站、年度报告、财务报告、国家政府文件和统计数据库等。报告中列出的主要公司有 Amkor Technology, Inc.;日月光集团;美国电话电报公司奥地利科技公司系统技术股份公司;藤仓有限公司;通用电气公司;英飞凌科技股份公司;美高森美;施韦泽电子股份公司;和台积电
Strategic insights for Europe Embedded Die Packaging Technology involve closely monitoring industry trends, consumer behaviours, and competitor actions to identify opportunities for growth. By leveraging data analytics, businesses can anticipate market shifts and make informed decisions that align with evolving customer needs. Understanding these dynamics helps companies adjust their strategies proactively, enhance customer engagement, and strengthen their competitive edge. Building strong relationships with stakeholders and staying agile in response to changes ensures long-term success in any market.
Report Attribute | Details |
---|---|
Market size in 2020 | US$ 9,686.92 thousand |
Market Size by 2028 | US$ 35,043.61 thousand |
Global CAGR (2021 - 2028) | 17.8 % |
Historical Data | 2018-2019 |
Forecast period | 2021-2028 |
Segments Covered |
By 平台
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Regions and Countries Covered | 欧洲
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Market leaders and key company profiles |
The regional scope of Europe Embedded Die Packaging Technology refers to the geographical area in which a business operates and competes. Understanding regional nuances, such as local consumer preferences, economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved regions or adapting their offerings to meet regional demands. A clear regional focus allows for more effective resource allocation, targeted marketing, and better positioning against local competitors, ultimately driving growth in those specific areas.
The Europe Embedded Die Packaging Technology Market is valued at US$ 9,686.92 thousand in 2020, it is projected to reach US$ 35,043.61 thousand by 2028.
As per our report Europe Embedded Die Packaging Technology Market, the market size is valued at US$ 9,686.92 thousand in 2020, projecting it to reach US$ 35,043.61 thousand by 2028. This translates to a CAGR of approximately 17.8 % during the forecast period.
The Europe Embedded Die Packaging Technology Market report typically cover these key segments-
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The Europe Embedded Die Packaging Technology Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
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Essentially, anyone involved in or considering involvement in the Europe Embedded Die Packaging Technology Market value chain can benefit from the information contained in a comprehensive market report.