欧洲、中东和非洲和亚太地区焊接材料市场规模和预测(2020 - 2030 年)、区域份额、趋势和增长机会分析报告范围:按产品(焊膏、棒材、线材、球体等)和工艺(打印机、激光、波峰焊、回流焊及其他)

Historic Data: 2020-2021   |   Base Year: 2022   |   Forecast Period: 2023-2030


No. of Pages: 159    |    Report Code: BMIRE00030050    |    Category: Chemicals and Materials

EMEA and APAC Solder Materials Market
欧洲、中东和非洲和亚太地区焊接材料市场预计将从 2022 年的 47.3 亿美元增长到 2030 年达到 67.2 亿美元。预计 2022 年至 2030 年复合年增长率为 4.5%。焊接材料包括广泛用于电子组装和焊接工艺的产品。这些材料对于在电子元件和电路板之间构建可靠的电气连接至关重要。在平板电脑、笔记本电脑和智能手机等消费电子产品需求不断增长的推动下,电子行业的不断扩张正在推动焊接材料市场的发展。欧洲、中东和非洲以及亚太地区(EMEA 和 APAC)焊接材料市场正在经历显着增长,这主要受到汽车和电信这两个关键行业需求激增的推动。此外,电子设备小型化和更紧凑的趋势需要能够形成高可靠性的细间距连接的焊接材料。正在进行的有关开发创新焊料材料(例如低温焊料合金和免清洗焊剂)的研究是不断发展的行业所关注的问题。根据产品,欧洲、中东和非洲 (EMEA) 和亚太地区焊料市场分为焊膏、焊条、焊丝、焊球等。焊膏细分市场预计将成为 2022 年至 2030 年增长最快的细分市场。焊膏用于电子行业的表面安装组装工艺。它是粉末金属和焊剂的混合物。焊接过程中加热时,焊膏熔化,在元件和电路板之间形成粘合。它通过在孔内/上方印刷焊膏而用于通孔插针焊膏元件。通过模板印刷或喷射印刷将焊膏涂在电路板上,并通过拾放机或手工将元件安装到位。然而,这些过程需要适量的糊剂。在PCB生产过程中,印刷电路板(PCB)制造商通常通过焊膏检查来测试焊膏沉积情况。检查系统在安装元件和熔化焊料之前测量焊盘的体积。此外,几乎所有垂直行业的企业都已经意识到通信、物联网和传感器的重要性,并为将传感器集成到设备中铺平了道路。汽车、医疗保健、消费电子设备以及航空航天和国防等垂直行业的供应链规划、物流和制造等众多业务功能都可以得到优化,从而提高盈利能力。由于将支持传感器的设备集成到业务流程中,对公司的资产负债表产生了积极影响,从而导致了对更多此类设备的巨大需求。预计巨大的需求将进一步给半导体行业带来负担。因此,预计各种 IC 制造中的焊接材料的增长将在预测期内迅速增长,而物联网在未来几年将变得更加突出。这些材料满足标准焊接要求,但也符合物联网设备的特殊需求,包括耐环境因素、温度变化和长期耐用性。随着制造商不断适应和创新以满足这个充满活力的行业不断变化的需求,物联网应用的复杂性和多样性预计将推动焊接材料市场的增长。 Indium Corp、Fusion Inc、Element Solutions Inc、KOKI Co Ltd、Stannol GmbH & Co KG、AIM Metals & Alloys LP、Nihon Superior Co Ltd、GENMA Europe GmbH 和 National Solder Co Ltd 是欧洲、中东和非洲地区的领先参与者亚太地区焊接材料市场。这些公司正在通过并购和产品发布来扩大其地域影响力和消费者基础。欧洲、中东和非洲和亚太地区焊接材料市场的总体规模是通过主要和次要来源得出的。为了开始研究过程,我们利用内部和外部来源进行了详尽的二次研究,以获得与市场相关的定性和定量信息。此外,我们还与行业参与者进行了多次初步访谈,以验证数据并获得更多分析见解。该流程的参与者包括副总裁、业务开发经理、市场情报经理和国家销售经理等行业专家,以及专注于 EMEA 和亚太地区焊料市场的外部顾问,包括估值专家、研究分析师和关键意见领袖。

EMEA and APAC Solder Materials Strategic Insights

Strategic insights for EMEA and APAC Solder Materials involve closely monitoring industry trends, consumer behaviours, and competitor actions to identify opportunities for growth. By leveraging data analytics, businesses can anticipate market shifts and make informed decisions that align with evolving customer needs. Understanding these dynamics helps companies adjust their strategies proactively, enhance customer engagement, and strengthen their competitive edge. Building strong relationships with stakeholders and staying agile in response to changes ensures long-term success in any market.

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EMEA and APAC Solder Materials Report Scope

Report Attribute Details
Market size in 2022 US$ 4.73 Billion
Market Size by 2030 US$ 6.72 Billion
Global CAGR (2022 - 2030) 4.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By 产品
  • 膏状
  • 棒状
  • 线状
  • 球状
By 工艺
  • 打印机
  • 激光
  • 波峰焊
  • 回流焊
Regions and Countries Covered 欧洲
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 意大利
  • 欧洲其他地区
中东和非洲
  • 南非
  • 沙特阿拉伯
  • 阿联酋
  • 中东和非洲其他地区
亚太地区
  • 中国
  • 印度
  • 日本
  • 澳大利亚
  • 亚太地区其他地区
Market leaders and key company profiles
  • AIM Metals & Alloys LP
  • KOKI Co Ltd
  • Fusion Inc
  • Stannol GmbH & Co KG
  • National Solder Co (PTY) Ltd
  • Nihon Superior Co Ltd
  • GENMA Europe GmbH
  • Indium Corp
  • Element Solutions Inc
  • Harima Chemicals Group Inc
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    EMEA and APAC Solder Materials Regional Insights

    The regional scope of EMEA and APAC Solder Materials refers to the geographical area in which a business operates and competes. Understanding regional nuances, such as local consumer preferences, economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved regions or adapting their offerings to meet regional demands. A clear regional focus allows for more effective resource allocation, targeted marketing, and better positioning against local competitors, ultimately driving growth in those specific areas.

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    The List of Companies - EMEA and APAC Solder Materials Market

    The List of Companies - EMEA and APAC Solder Materials Market

  • AIM Metals & Alloys LP

  • KOKI Co Ltd?

  • Fusion Inc

  • Stannol GmbH & Co KG?

  • National Solder Co (PTY) Ltd

  • Nihon Superior Co Ltd

  • GENMA Europe GmbH?

  • Indium Corp?

  • Element Solutions Inc?

  • Harima Chemicals Group Inc
  • Frequently Asked Questions
    How big is the EMEA and APAC Solder Materials Market?

    The EMEA and APAC Solder Materials Market is valued at US$ 4.73 Billion in 2022, it is projected to reach US$ 6.72 Billion by 2030.

    What is the CAGR for EMEA and APAC Solder Materials Market by (2022 - 2030)?

    As per our report EMEA and APAC Solder Materials Market, the market size is valued at US$ 4.73 Billion in 2022, projecting it to reach US$ 6.72 Billion by 2030. This translates to a CAGR of approximately 4.5% during the forecast period.

    What segments are covered in this report?

    The EMEA and APAC Solder Materials Market report typically cover these key segments-

  • 产品 (膏状, 棒状, 线状, 球状)
  • 工艺 (打印机, 激光, 波峰焊, 回流焊)
  • What is the historic period, base year, and forecast period taken for EMEA and APAC Solder Materials Market?

    The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the EMEA and APAC Solder Materials Market report:

  • Historic Period : 2020-2021
  • Base Year : 2022
  • Forecast Period : 2023-2030
  • Who are the major players in EMEA and APAC Solder Materials Market?

    The EMEA and APAC Solder Materials Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:

  • AIM Metals & Alloys LP
  • KOKI Co Ltd
  • Fusion Inc
  • Stannol GmbH & Co KG
  • National Solder Co (PTY) Ltd
  • Nihon Superior Co Ltd
  • GENMA Europe GmbH
  • Indium Corp
  • Element Solutions Inc
  • Harima Chemicals Group Inc
  • Who should buy this report?

    The EMEA and APAC Solder Materials Market report is valuable for diverse stakeholders, including:

    • Investors: Provides insights for investment decisions pertaining to market growth, companies, or industry insights. Helps assess market attractiveness and potential returns.
    • Industry Players: Offers competitive intelligence, market sizing, and trend analysis to inform strategic planning, product development, and sales strategies.
    • Suppliers and Manufacturers: Helps understand market demand for components, materials, and services related to concerned industry.
    • Researchers and Consultants: Provides data and analysis for academic research, consulting projects, and market studies.
    • Financial Institutions: Helps assess risks and opportunities associated with financing or investing in the concerned market.

    Essentially, anyone involved in or considering involvement in the EMEA and APAC Solder Materials Market value chain can benefit from the information contained in a comprehensive market report.