1. Introduction
1.1 Business Market Insights Research Report Guidance
1.2 Market Segmentation
2. Executive Summary
2.1 Key Market Insights
2.2 Market Attractiveness
3. Research Methodology
3.1 Secondary Research
3.2 Primary Research
- 3.2.1 Hypothesis formulation:
- 3.2.2 Macro-economic factor analysis:
- 3.2.3 Developing base number:
- 3.2.4 Data Triangulation:
- 3.2.5 Country level data:
4. North America Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Competitive Rivalry
- 4.2.5 Threat of Substitutes
4.3 Ecosystem Analysis
- 4.3.1 Raw Material Suppliers
- 4.3.2 Manufacturers
- 4.3.3 Distributors/Suppliers
- 4.3.4 End Users
5. North America Embedded Die Packaging Technology Market – Key Market Dynamics
5.1 Growth Drivers
- 5.1.1 Growing Demand for Miniaturization of Electronic Devices to Favor Market
5.2 Market Opportunities
- 5.2.1 Rapid Growth in Wearable Devices and the Internet of Things.
5.3 Future Trends
- 5.3.1 The rapid growth in wearable devices and the Internet of Things is anticipated to drive the market in the forecast period.
5.4 Impact of Drivers and Restraints
6. North America Embedded Die Packaging Technology Market Regional Analysis
6.1 North America Embedded Die Packaging Technology Market Overview
6.2 North America Embedded Die Packaging Technology Market Revenue 2018-2028 (US$ Thousand)
6.3 North America Embedded Die Packaging Technology Market Forecast Analysis
7. North America Embedded Die Packaging Technology Market Analysis – by Platform
7.1 IC Package Substrate
- 7.1.1 Overview
- 7.1.2 IC Package Substrate: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2031 (US$ Thousand)
7.2 Rigid Board
- 7.2.1 Overview
- 7.2.2 Rigid Board: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2031 (US$ Thousand)
7.3 Flexible Board
- 7.3.1 Overview
- 7.3.2 Flexible Board: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2031 (US$ Thousand)
8. North America Embedded Die Packaging Technology Market Analysis – by Application
8.1 Smartphone and Tablets
- 8.1.1 Overview
- 8.1.2 Smartphone and Tablets: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.2 Medical and Wearable Devices
- 8.2.1 Overview
- 8.2.2 Medical and Wearable Devices: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.3 Industrial Devices
- 8.3.1 Overview
- 8.3.2 Industrial Devices: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.4 Security Devices
- 8.4.1 Overview
- 8.4.2 Security Devices: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.5 Other Applications
- 8.5.1 Overview
- 8.5.2 Other Applications: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9. North America Embedded Die Packaging Technology Market Analysis – by Industry
9.1 Consumer Electronics
- 9.1.1 Overview
- 9.1.2 Other Applications: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.2 IT and Telecommunication
- 9.2.1 Overview
- 9.2.2 Other Applications: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.3 Automotive
- 9.3.1 Overview
- 9.3.2 Other Applications: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.4 Healthcare
- 9.4.1 Overview
- 9.4.2 Other Applications: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.5 Other Industries
- 9.5.1 Overview
- 9.5.2 Other Applications: North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10. North America Embedded Die Packaging Technology Market – North America Analysis
10.1 North America
- 10.1.1 North America Embedded Die Packaging Technology Market Breakdown, by Key
Country, 2021 and 2028 (%)
- 10.1.1.1 North America Embedded Die Packaging Technology Market – Revenue and
Forecast Analysis – by Country
- 10.1.1.1 US:
North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.1.1 US: North America Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.1.2 US: North America Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.1.3 US: North America Embedded Die Packaging Technology Market Breakdown, by Industry
- 10.1.1.2 Canada:
North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.2.1 Canada: North America Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.2.2 Canada: North America Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.2.3 Canada: North America Embedded Die Packaging Technology Market Breakdown, by Industry
- 10.1.1.3 Mexico :
North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.3.1 Mexico : North America Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.3.2 Mexico : North America Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.3.3 Mexico : North America Embedded Die Packaging Technology Market Breakdown, by Industry
11. Competitive Landscape
11.1 Heat Map Analysis
11.2 Company Positioning and Concentration
12. North America Embedded Die Packaging Technology Market Industry Landscape
12.1 Overview
12.2 Mergers and Acquisitions
12.3 Agreements, Collaborations, and Joint Ventures
12.4 New Product Launches
12.5 Expansions and Other Strategic Developments
13. Company Profiles
13.1 Amkor Technology, Inc.
- 13.1.1 Key Facts
- 13.1.2 Business Description
- 13.1.3 Products and Services
- 13.1.4 Financial Overview
- 13.1.5 SWOT Analysis
- 13.1.6 Key Developments
13.2 ASE Group
- 13.2.1 Key Facts
- 13.2.2 Business Description
- 13.2.3 Products and Services
- 13.2.4 Financial Overview
- 13.2.5 SWOT Analysis
- 13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- 13.3.1 Key Facts
- 13.3.2 Business Description
- 13.3.3 Products and Services
- 13.3.4 Financial Overview
- 13.3.5 SWOT Analysis
- 13.3.6 Key Developments
13.4 Fujikura Ltd.
- 13.4.1 Key Facts
- 13.4.2 Business Description
- 13.4.3 Products and Services
- 13.4.4 Financial Overview
- 13.4.5 SWOT Analysis
- 13.4.6 Key Developments
13.5 General Electric Company
- 13.5.1 Key Facts
- 13.5.2 Business Description
- 13.5.3 Products and Services
- 13.5.4 Financial Overview
- 13.5.5 SWOT Analysis
- 13.5.6 Key Developments
13.6 Infineon Technologies AG
- 13.6.1 Key Facts
- 13.6.2 Business Description
- 13.6.3 Products and Services
- 13.6.4 Financial Overview
- 13.6.5 SWOT Analysis
- 13.6.6 Key Developments
13.7 Microsemi
- 13.7.1 Key Facts
- 13.7.2 Business Description
- 13.7.3 Products and Services
- 13.7.4 Financial Overview
- 13.7.5 SWOT Analysis
- 13.7.6 Key Developments
13.8 Schweizer Electronic AG
- 13.8.1 Key Facts
- 13.8.2 Business Description
- 13.8.3 Products and Services
- 13.8.4 Financial Overview
- 13.8.5 SWOT Analysis
- 13.8.6 Key Developments
13.9 Shinko Electric Industries Co., Ltd.
- 13.9.1 Key Facts
- 13.9.2 Business Description
- 13.9.3 Products and Services
- 13.9.4 Financial Overview
- 13.9.5 SWOT Analysis
- 13.9.6 Key Developments
13.10 Taiwan Semiconductor Manufacturing Company, Limited
- 13.10.1 Key Facts
- 13.10.2 Business Description
- 13.10.3 Products and Services
- 13.10.4 Financial Overview
- 13.10.5 SWOT Analysis
- 13.10.6 Key Developments
14. Appendix
14.1 About Business Market Insights