1. Introduction
1.1 Business Market Insights Research Report Guidance
1.2 Market Segmentation
2. Executive Summary
2.1 Key Market Insights
2.2 Market Attractiveness
3. Research Methodology
3.1 Secondary Research
3.2 Primary Research
- 3.2.1 Hypothesis formulation:
- 3.2.2 Macro-economic factor analysis:
- 3.2.3 Developing base number:
- 3.2.4 Data Triangulation:
- 3.2.5 Country level data:
4. Europe Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Competitive Rivalry
- 4.2.5 Threat of Substitutes
4.3 Ecosystem Analysis
- 4.3.1 Raw Material Suppliers
- 4.3.2 Manufacturers
- 4.3.3 Distributors/Suppliers
- 4.3.4 End Users
5. Europe Embedded Die Packaging Technology Market – Key Market Dynamics
5.1 Growth Drivers
- 5.1.1 Growing Demand for Miniaturization of Electronic Devices to Favor Market
5.2 Market Opportunities
- 5.2.1 Rapid Growth in Wearable Devices and the Internet of Things.
5.3 Future Trends
- 5.3.1 The rapid growth in wearable devices and the Internet of Things is anticipated to drive the market in the forecast period.
5.4 Impact of Drivers and Restraints
6. Europe Embedded Die Packaging Technology Market Regional Analysis
6.1 Europe Embedded Die Packaging Technology Market Overview
6.2 Europe Embedded Die Packaging Technology Market Revenue 2018-2028 (US$ Thousand)
6.3 Europe Embedded Die Packaging Technology Market Forecast Analysis
7. Europe Embedded Die Packaging Technology Market Analysis – by Platform
7.1 IC Package Substrate
- 7.1.1 Overview
- 7.1.2 IC Package Substrate: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2031 (US$ Thousand)
7.2 Rigid Board
- 7.2.1 Overview
- 7.2.2 Rigid Board: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2031 (US$ Thousand)
7.3 Flexible Board
- 7.3.1 Overview
- 7.3.2 Flexible Board: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2031 (US$ Thousand)
8. Europe Embedded Die Packaging Technology Market Analysis – by Application
8.1 Smartphone and Tablets
- 8.1.1 Overview
- 8.1.2 Smartphone and Tablets: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.2 Medical and Wearable Devices
- 8.2.1 Overview
- 8.2.2 Medical and Wearable Devices: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.3 Industrial Devices
- 8.3.1 Overview
- 8.3.2 Industrial Devices: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.4 Security Devices
- 8.4.1 Overview
- 8.4.2 Security Devices: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.5 Other Applications
- 8.5.1 Overview
- 8.5.2 Other Applications: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9. Europe Embedded Die Packaging Technology Market Analysis – by Industry
9.1 Consumer Electronics
- 9.1.1 Overview
- 9.1.2 Other Applications: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.2 IT and Telecommunication
- 9.2.1 Overview
- 9.2.2 Other Applications: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.3 Automotive
- 9.3.1 Overview
- 9.3.2 Other Applications: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.4 Healthcare
- 9.4.1 Overview
- 9.4.2 Other Applications: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.5 Other Industries
- 9.5.1 Overview
- 9.5.2 Other Applications: Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10. Europe Embedded Die Packaging Technology Market – Europe Analysis
10.1 Europe
- 10.1.1 Europe Embedded Die Packaging Technology Market Breakdown, by Key
Country, 2021 and 2028 (%)
- 10.1.1.1 Europe Embedded Die Packaging Technology Market – Revenue and
Forecast Analysis – by Country
- 10.1.1.1 UK:
Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.1.1 UK: Europe Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.1.2 UK: Europe Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.1.3 UK: Europe Embedded Die Packaging Technology Market Breakdown, by Industry
- 10.1.1.2 Germany:
Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.2.1 Germany: Europe Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.2.2 Germany: Europe Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.2.3 Germany: Europe Embedded Die Packaging Technology Market Breakdown, by Industry
- 10.1.1.3 France:
Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.3.1 France: Europe Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.3.2 France: Europe Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.3.3 France: Europe Embedded Die Packaging Technology Market Breakdown, by Industry
- 10.1.1.4 Russia:
Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.4.1 Russia: Europe Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.4.2 Russia: Europe Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.4.3 Russia: Europe Embedded Die Packaging Technology Market Breakdown, by Industry
- 10.1.1.5 Italy:
Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.5.1 Italy: Europe Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.5.2 Italy: Europe Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.5.3 Italy: Europe Embedded Die Packaging Technology Market Breakdown, by Industry
- 10.1.1.6 Rest of Europe:
Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
- 10.1.1.6.1 Rest of Europe: Europe Embedded Die Packaging Technology Market Breakdown, by Platform
- 10.1.1.6.2 Rest of Europe: Europe Embedded Die Packaging Technology Market Breakdown, by Application
- 10.1.1.6.3 Rest of Europe: Europe Embedded Die Packaging Technology Market Breakdown, by Industry
11. Competitive Landscape
11.1 Heat Map Analysis
11.2 Company Positioning and Concentration
12. Europe Embedded Die Packaging Technology Market Industry Landscape
12.1 Overview
12.2 Mergers and Acquisitions
12.3 Agreements, Collaborations, and Joint Ventures
12.4 New Product Launches
12.5 Expansions and Other Strategic Developments
13. Company Profiles
13.1 Amkor Technology, Inc.
- 13.1.1 Key Facts
- 13.1.2 Business Description
- 13.1.3 Products and Services
- 13.1.4 Financial Overview
- 13.1.5 SWOT Analysis
- 13.1.6 Key Developments
13.2 ASE Group
- 13.2.1 Key Facts
- 13.2.2 Business Description
- 13.2.3 Products and Services
- 13.2.4 Financial Overview
- 13.2.5 SWOT Analysis
- 13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- 13.3.1 Key Facts
- 13.3.2 Business Description
- 13.3.3 Products and Services
- 13.3.4 Financial Overview
- 13.3.5 SWOT Analysis
- 13.3.6 Key Developments
13.4 Fujikura Ltd.
- 13.4.1 Key Facts
- 13.4.2 Business Description
- 13.4.3 Products and Services
- 13.4.4 Financial Overview
- 13.4.5 SWOT Analysis
- 13.4.6 Key Developments
13.5 General Electric Company
- 13.5.1 Key Facts
- 13.5.2 Business Description
- 13.5.3 Products and Services
- 13.5.4 Financial Overview
- 13.5.5 SWOT Analysis
- 13.5.6 Key Developments
13.6 Infineon Technologies AG
- 13.6.1 Key Facts
- 13.6.2 Business Description
- 13.6.3 Products and Services
- 13.6.4 Financial Overview
- 13.6.5 SWOT Analysis
- 13.6.6 Key Developments
13.7 Microsemi
- 13.7.1 Key Facts
- 13.7.2 Business Description
- 13.7.3 Products and Services
- 13.7.4 Financial Overview
- 13.7.5 SWOT Analysis
- 13.7.6 Key Developments
13.8 Schweizer Electronic AG
- 13.8.1 Key Facts
- 13.8.2 Business Description
- 13.8.3 Products and Services
- 13.8.4 Financial Overview
- 13.8.5 SWOT Analysis
- 13.8.6 Key Developments
13.9 Taiwan Semiconductor Manufacturing Company, Limited
- 13.9.1 Key Facts
- 13.9.2 Business Description
- 13.9.3 Products and Services
- 13.9.4 Financial Overview
- 13.9.5 SWOT Analysis
- 13.9.6 Key Developments
14. Appendix
14.1 About Business Market Insights