North America SiP Technology Market
No. of Pages: 135 | Report Code: TIPRE00018173 | Category: Electronics and Semiconductor
No. of Pages: 135 | Report Code: TIPRE00018173 | Category: Electronics and Semiconductor
Semiconductor industry is evolving with innovations in product offering to support digitalization. Rising demand for the IoT based electronic devices to enhance connectivity is further propelling the market growth. Advent of 5G network in North America market created lucrative opportunity for the market player to develop new line of electronics devices, having compatibility with 5G connectivity. Rising miniaturization of the electronics to optimize space and design is being fulfilled with system in package technology. New electronic devices require enhanced performance within similar space or compact space for which major companies are selecting SiP. The advanced packaging technologies have to capacity to resolve the 5G chip performance requirements. New packaging technology such as SiP offers solution for various issues like heat dissipation, power consumption and product dimension with embedded antenna for enhanced speed. The system in package technologies are gaining major adoption in North America. Also, electronic miniaturization is at high demand is a major factor driving the North America SiP technology market.
Furthermore, COVID-19 is having a very devastating impact over the North America region. Presently, the US is the worst-affected country due to the COVID-19 outbreak. North America is one of the most important regions for the adoption and growth of new technologies owing to favorable government policies to boost innovation, the presence of a high-tech companies, and high purchasing power, especially in developed countries such as the US and Canada. North American market suffered huge loss in the first half of 2020 owing to high number of COVID-19 patient’s cases, specifically in the US. Post lockdown a market witnessed increasing demand for the digital devices. North America is among the eminent regions in the adoption of advanced network connection devices owing to favorable infrastructure support for high speed internet services. The adoption of the 5G network is supposed to drive the market growth post lockdown. The effect has major impact on manufacturing facilities as production capacities was lowered. Although, the demand for electronics remained still which helped the market to resume the growth. For instance, in December, 2020, Qualcomm Inc a leading manufacturer of microprocessors has predicted that shipments of 5G smartphones will double in year 2022, driven by increasing 5G network deployment. Such increasing adoption of 5G network is lowering the COVID-19 impact for the post lockdown period, while in lockdown it certainly hampered the market growth.
Strategic insights for the North America SiP Technology provides data-driven analysis of the industry landscape, including current trends, key players, and regional nuances. These insights offer actionable recommendations, enabling readers to differentiate themselves from competitors by identifying untapped segments or developing unique value propositions. Leveraging data analytics, these insights help industry players anticipate the market shifts, whether investors, manufacturers, or other stakeholders. A future-oriented perspective is essential, helping stakeholders anticipate market shifts and position themselves for long-term success in this dynamic region. Ultimately, effective strategic insights empower readers to make informed decisions that drive profitability and achieve their business objectives within the market.
| Report Attribute | Details |
|---|---|
| Market size in 2019 | US$ 4553.9 Million |
| Market Size by 2027 | US$ 7676.1 Million |
| Global CAGR (2020 - 2027) | 9.1% |
| Historical Data | 2017-2018 |
| Forecast period | 2020-2027 |
| Segments Covered |
By Packaging Technology
|
| Regions and Countries Covered | North America
|
| Market leaders and key company profiles |
The geographic scope of the North America SiP Technology refers to the specific areas in which a business operates and competes. Understanding local distinctions, such as diverse consumer preferences (e.g., demand for specific plug types or battery backup durations), varying economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved areas or adapting their offerings to meet local demands. A clear market focus allows for more effective resource allocation, targeted marketing campaigns, and better positioning against local competitors, ultimately driving growth in those targeted areas.
The SiP technology market in North America is expected to grow from US$ 4553.9 million in 2019 to US$ 7676.1 million by 2027; it is estimated to grow at a CAGR of 9.1% from 2020 to 2027. The system in package technology has huge opportunity in the smartphone and PC market to offers advanced processors, transmitters and other components. Technology is improving the device performance as well as offering better space utilization solution. Few market players are developing the processors and other components using the system in packaging technology, while for others its great opportunity to innovate new solution for smartphone and PC processors. For instance, March, 2019, Asus, one of the leading smartphone brands in North America market introduced new ZenFone Max Shot and ZenFone Max Plus M2 smartphones equipped with Qualcomm's new Snapdragon SiP1 chip. Similarly, in December, 2019, Qualcomm developed new arm-based processors for notebooks using the SE Technology’s system-in-package (SiP) services. Such development in the SiP offering in smartphone and PC applications clearly shows the potential opportunity for the market. Rising consumption of smartphones is major supporting factor for the market for which market players needs to provide more focus.
In terms of packaging technology, the 2D IC segment accounted for the largest share of the Europe SiP technology market in 2019. Based on packaging type, the flip-chip/wire-bond SiP segment held a larger market share of the Europe SiP technology market in 2019. On basis of interconnection technique, pin grid arrays held a substantial share throughout the forecast period. Based on end-user industry, consumer electronics segment is expected to hold largest market share during the forecast period.
A few major primary and secondary sources referred to for preparing this report on the SiP technology market in North America are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Technology Holding Co., Ltd.; ChipMOS TECHNOLOGIES INC.; JCET Group Co., Ltd.; Qualcomm Technologies, Inc.; Renesas Electronics Corporation; Samsung; Taiwan Semiconductor Manufacturing Company, Limited; and Texas Instruments Incorporated.
Some of the leading companies are:
The North America SiP Technology Market is valued at US$ 4553.9 Million in 2019, it is projected to reach US$ 7676.1 Million by 2027.
As per our report North America SiP Technology Market, the market size is valued at US$ 4553.9 Million in 2019, projecting it to reach US$ 7676.1 Million by 2027. This translates to a CAGR of approximately 9.1% during the forecast period.
The North America SiP Technology Market report typically cover these key segments-
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the North America SiP Technology Market report:
The North America SiP Technology Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
The North America SiP Technology Market report is valuable for diverse stakeholders, including:
Essentially, anyone involved in or considering involvement in the North America SiP Technology Market value chain can benefit from the information contained in a comprehensive market report.
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