North America Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphone and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries)
Market Introduction
Technological advancements have led to a highly competitive market in the region as populations attract several technological developments owing to high spending powers. With the high adoption of consumer electronic devices, the consumer electronics industry is blooming in the region. Smartphones, personal computers, tablets, washing machines, television sets, and other consumer electronics devices have found a wider user base in North America. The embedded die packaging technology enables manufacturers to offer electronic devices with small form factor. Additionally, the rising adoption of 5G networks is creating strong opportunity for the market players to develop advanced RF modules using system in package technology for connectivity. According to the Ericsson’s mobility report, the share of 5G network in the North America market is expected to grow from 4% in 2020 to 80% by 2026, while the rest 20% would be held by the 4G technology. This highlights the opportunities for electronic companies to develop new electronics devices comprising ICs packed with embedded die packaging technology to meet the evolving performance requirements. Rising demand for miniaturization of electronic devices and growing developments in embedded die packaging technology are the major factor driving the growth of the North America embedded die packaging technology market.
In case of COVID-19, North America is highly affected specially the US. Post lockdown, the market witnessed increasing demand for digital devices. North America is among the eminent regions in adopting smart or IoT-based devices due to favorable infrastructure support for high-speed internet services. The adoption of the 5G network is supposed to drive the market growth post lockdown. The COVID-19 outbreak has a major impact on manufacturing facilities as production capacities were lowered. As the demand for electronics remained constant, it helped the market to resume the growth. For instance, in December 2020, Qualcomm Inc, a leading manufacturer of microprocessors has predicted that the shipments of 5G smartphones will double in 2022, with the increasing 5G network deployment. Such increasing adoption of 5G smartphones is lowering the COVID- 19 impact for the post lockdown period; while in lockdown, it certainly hampered the market growth.
Get more information on this report :
Market Overview and Dynamics
The North America embedded die packaging technology market is expected to grow from US$ 19,859.76 thousand in 2020 to US$ 80,904.35 thousand by 2028; it is estimated to grow at a CAGR of 19.5 % from 2021 to 2028. Increasing demand to enhance smartphone and automotive device performance will drive the market growth. The embedded die packaging technology has a huge opportunity in the smartphone and PC market to offer advanced processors, transmitters, and other components. Embedded die packaging technology enhances the device performance and provides better space utilization solutions. A few market players across North America are developing ICs and other components using the embedded die packaging technology, while for others, it is an excellent opportunity to innovate new solutions for smartphones and tablets. For instance, market players such as AT&S, SHINKO, and ASE Group offer the embedded die packaging technology for smartphones. The rising consumption of smartphones is a major supporting factor for the market growth in coming years. To grab a leading position, companies need to develop new processors with compact size and high-performance level. Similarly, the rise in demand for embedded die packaging technology in automotive applications is expected to offer new growth opportunities for players in the North America market. For instance, Infineon Technologies AG is offering embedded power ICs for automotive motor control solutions. Further, increasing electrification and the advent of IoT devices in vehicles create a lucrative opportunity for the market.
Key Market Segments
In terms of platform, the IC package substrate segment accounted for the largest share of the North America embedded die packaging technology market in 2020. In terms of application, the smartphone and tablets segment held a larger market share of the North America embedded die packaging technology market in 2020. Further, the consumer electronics segment held a larger share of the North America embedded die packaging technology market based on industry in 2020.
Major Sources and Companies Listed
A few major primary and secondary sources referred to for preparing this report on the North America embedded die packaging technology market are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd.; and Taiwan Semiconductor Manufacturing Company, Limited
Reasons to buy report
- To understand the North America embedded die packaging technology market landscape and identify market segments that are most likely to guarantee a strong return
- Stay ahead of the race by comprehending the ever-changing competitive landscape for North America embedded die packaging technology market
- Efficiently plan M&A and partnership deals in North America embedded die packaging technology market by identifying market segments with the most promising probable sales
- Helps to take knowledgeable business decisions from perceptive and comprehensive analysis of market performance of various segment form North America embedded die packaging technology market
- Obtain market revenue forecast for market by various segments from 2021-2028 in North America region.
North America Embedded Die Packaging Technology Market Segmentation
North America Embedded Die Packaging Technology Market - By Platform
- IC Package Substrate
- Rigid Board
- Flexible Board
North America Embedded Die Packaging Technology Market - By Application
- Smartphone and Tablets
- Medical and Wearable Devices
- Industrial Devices
- Security Devices
- Other Applications
North America Embedded Die Packaging Technology Market - By Industry
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Other Industries
North America Embedded Die Packaging Technology Market - By Country
- US
- Canada
- Mexico
North America Embedded Die Packaging Technology Market - Company Profiles
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- Infineon Technologies AG
- Microsemi
- Schweizer Electronic AG
- Shinko Electric Industries Co., Ltd.
- Taiwan Semiconductor Manufacturing Company, Limited
1. Introduction
1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 North America Embedded Die Packaging Technology Market – By Platform
1.3.2 North America Embedded Die Packaging Technology Market – By Application
1.3.3 North America Embedded Die Packaging Technology Market – By Industry
1.3.4 North America Embedded Die Packaging Technology Market- By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. North America Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 North America PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinion
5. North America Embedded Die Packaging Technology Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Demand for Miniaturization of Electronic Devices
5.1.2 Growing Developments in Embedded Die Packaging Technology
5.2 Market Restraints
5.2.1 Technical Problems and Presence of Alternative Solutions
5.3 Market Opportunities
5.3.1 Increasing Demand to Enhance Smartphone and Automotive Device Performance
5.4 Future Trends
5.4.1 Growth in Wearable Devices and Internet of Things
5.5 Impact Analysis of Drivers and Restraints
6. Embedded Die Packaging Technology Market – North America Analysis
6.1 North America Embedded Die Packaging Technology Market Overview
6.2 North America Embedded Die Packaging Technology Market –Revenue and Forecast to 2028 (US$ Thousand)
7. North America Embedded Die Packaging Technology Market Analysis – By Platform
7.1 Overview
7.2 North America Embedded Die Packaging Technology Market, By Platform (2020 and 2028)
7.3 IC Package Substrate
7.3.1 Overview
7.3.2 IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.4 Rigid Board
7.4.1 Overview
7.4.2 Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.5 Flexible Board
7.5.1 Overview
7.5.2 Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8. North America Embedded Die Packaging Technology Market – By Application
8.1 Overview
8.2 North America Embedded Die Packaging Technology Market, by Application (2020 and 2028)
8.3 Smartphone and Tablets
8.3.1 Overview
8.3.2 Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.4 Medical and Wearable Devices
8.4.1 Overview
8.4.2 Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.5 Industrial Devices
8.5.1 Overview
8.5.2 Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.6 Security Devices
8.6.1 Overview
8.6.2 Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.7 Other Applications
8.7.1 Overview
8.7.2 Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9. North America Embedded Die Packaging Technology Market – By Industry
9.1 Overview
9.2 North America Embedded Die Packaging Technology Market, by Industry (2020 and 2028)
9.3 Consumer Electronics
9.3.1 Overview
9.3.2 Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.4 IT and Telecommunication
9.4.1 Overview
9.4.2 IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.5 Automotive
9.5.1 Overview
9.5.2 Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.6 Healthcare
9.6.1 Overview
9.6.2 Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.7 Other Industries
9.7.1 Overview
9.7.2 Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10. North America Embedded Die Packaging Technology Market – Country Analysis
10.1 Overview
10.1.1 North America: Embedded Die Packaging Technology Market- by Key Country
10.1.1.1 US: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.1.1 US: Embedded Die Packaging Technology Market- By Platform
10.1.1.1.2 US: Embedded Die Packaging Technology Market- By Application
10.1.1.1.3 US: Embedded Die Packaging Technology Market- By Industry
10.1.1.2 Canada: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.2.1 Canada: Embedded Die Packaging Technology Market- By Platform
10.1.1.2.2 Canada: Embedded Die Packaging Technology Market- By Application
10.1.1.2.3 Canada: Embedded Die Packaging Technology Market- By Industry
10.1.1.3 Mexico: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.3.1 Mexico: Embedded Die Packaging Technology Market- By Platform
10.1.1.3.2 Mexico: Embedded Die Packaging Technology Market- By Application
10.1.1.3.3 Mexico: Embedded Die Packaging Technology Market- By Industry
11. North America Embedded Die Packaging Technology Market- COVID-19 Impact Analysis
11.1 North America
12. Industry Landscape
12.1 Overview
12.2 Market Initiative
12.3 New Product Development
13. Company Profiles
13.1 ASE Group
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Amkor Technology, Inc.
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 Fujikura Ltd.
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 General Electric Company
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 Infineon Technologies AG
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Microsemi
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Shinko Electric Industries Co., Ltd.
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 Schweizer Electronic AG
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
13.10 Taiwan Semiconductor Manufacturing Company, Limited
13.10.1 Key Facts
13.10.2 Business Description
13.10.3 Products and Services
13.10.4 Financial Overview
13.10.5 SWOT Analysis
13.10.6 Key Developments
14. Appendix
14.1 About The Insight Partners
14.2 Word Index
LIST OF TABLES
Table 1. North America Embedded Die Packaging Technology Market – Revenue, and Forecast to 2028 (US$ Thousand)
Table 2. US: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 3. US: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 4. US: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 5. Canada: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 6. Canada: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 7. Canada: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 8. Mexico: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 9. Mexico: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 10. Mexico: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 11. List of Abbreviation
LIST OF FIGURES
Figure 1. North America Embedded Die Packaging Technology Market Segmentation
Figure 2. North America Embedded Die Packaging Technology Market Segmentation – By Country
Figure 3. North America Embedded Die Packaging Technology Market Overview
Figure 4. IC Package Substrate Platform Held the Largest Market Share in 2020
Figure 5. Smartphones and Tablets Held the Largest Market Share in 2020
Figure 6. Consumer Electronics Held the Largest Market Share in 2020
Figure 7. US was the Largest Revenue Contributor in 2020
Figure 8. North America – PEST Analysis
Figure 9. North America Embedded Die Packaging Technology Market– Ecosystem Analysis
Figure 10. Expert Opinion
Figure 11. North America Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints
Figure 12. North America Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 13. North America Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)
Figure 14. North America IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 15. North America Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 16. North America Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 17. North America Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)
Figure 18. North America Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 19. North America Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 20. North America Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 21. North America Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 22. North America Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 23. North America Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)
Figure 24. North America Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 25. North America IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 26. North America Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 27. North America Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 28. North America Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 29. North America: Embedded Die Packaging Technology Market, by Key Country – Revenue (2020) (USD Thousand)
Figure 30. North America: Embedded Die Packaging Technology Market Revenue Share, by Key Country (2020 and 2028)
Figure 31. US: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 32. Canada: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 33. Mexico: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 34. Impact of COVID-19 Pandemic in North American Country Markets
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- Infineon Technologies AG
- Microsemi
- Schweizer Electronic AG
- Shinko Electric Industries Co., Ltd.
- Taiwan Semiconductor Manufacturing Company, Limited
- Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the North America embedded die packaging technology market.
- Highlights key business priorities in order to assist companies to realign their business strategies
- The key findings and recommendations highlight crucial progressive industry trends in North America embedded die packaging technology market, thereby allowing players across the value chain to develop effective long-term strategies
- Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
- Scrutinize in-depth North America market trends and outlook coupled with the factors driving the embedded die packaging technology market, as well as those hindering it
- Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution