Europe Embedded Die Packaging Technology Market

Historic Data: 2018-2019   |   Base Year: 2020   |   Forecast Period: 2021-2028

Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphone and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries)


No. of Pages: 125    |    Report Code: TIPRE00022131    |    Category: Electronics and Semiconductor

Europe Embedded Die Packaging Technology Market
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Market Introduction

Strong adoption of the advanced technology for manufacturing and commercial operations is driving the Europe embedded die packaging market. The automotive sector—led by Germany due to the presence of prominent car manufacturers such as Daimler AG, BMW, VW, Opel, and Audi—is the largest contributor to the market in Europe. As per the European Automobile Manufacturers Association, in 2019, ~15.8 million passenger cars were manufactured in the region; thus, the high investments by car manufacturers in their EV production capabilities is further propelling the market growth in Europe. The region also has a positive outlook for the adoption of IoT solution for increasing the overall industrial output. Apart from the increasing adoption of advanced electronics, increase in the number of aging European population is also creating demand for advanced healthcare devices. The healthcare sector is also developing and introducing innovative devices to meet the customer demands. Advanced technologies such as IoT and AI are further creating demand for microelectronics devices owing to which companies also expanding their footprint in the European market. Mounting developments in embedded die packaging technology and escalating demand for miniaturization of electronic devices are the major factor driving the growth of the Europe embedded die packaging technology market.

In case of COVID-19, Europe is highly affected specially the UK and Russia. Due to increased number of COVID-19 cases, the European market also witnessed a sluggish growth in the embedded die packaging technology in the first half of 2020. The semiconductor industry in Europe resumes growth at a slower rate compared to other markets, such as Asia and the U.S. The demand from industrial and automotive electronics has witnessed a substantial hit than consumer electronics due to the impact of COVID-19 pandemic. Post lockdown market has witnessed healthy growth rate owing to the increasing demand for advanced electronics devices to restart the facilities, operations, commercial places, and transportation.


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Europe Embedded Die Packaging Technology Strategic Insights

Strategic insights for the Europe Embedded Die Packaging Technology provides data-driven analysis of the industry landscape, including current trends, key players, and regional nuances. These insights offer actionable recommendations, enabling readers to differentiate themselves from competitors by identifying untapped segments or developing unique value propositions. Leveraging data analytics, these insights help industry players anticipate the market shifts, whether investors, manufacturers, or other stakeholders. A future-oriented perspective is essential, helping stakeholders anticipate market shifts and position themselves for long-term success in this dynamic region. Ultimately, effective strategic insights empower readers to make informed decisions that drive profitability and achieve their business objectives within the market.

strategic-framework/europe-embedded-die-packaging-technology-market-strategic-framework.webp
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Europe Embedded Die Packaging Technology Report Scope

Report Attribute Details
Market size in 2020 US$ 9,686.92 thousand
Market Size by 2028 US$ 35,043.61 thousand
Global CAGR (2021 - 2028) 17.8 %
Historical Data 2018-2019
Forecast period 2021-2028
Segments Covered By Platform
  • IC Package Substrate
  • Rigid Board
  • Flexible Board
By Application
  • Smartphone and Tablets
  • Medical and Wearable Devices
  • Industrial Devices
  • Security Devices
  • Other Applications
By Industry
  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Other Industries
Regions and Countries Covered Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Market leaders and key company profiles
  • Amkor Technology, Inc.
  • ASE Group
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • General Electric Company
  • Infineon Technologies AG
  • Microsemi
  • Schweizer Electronic AG
  • Taiwan Semiconductor Manufacturing Company, Limited
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    Europe Embedded Die Packaging Technology Regional Insights

    The geographic scope of the Europe Embedded Die Packaging Technology refers to the specific areas in which a business operates and competes. Understanding local distinctions, such as diverse consumer preferences (e.g., demand for specific plug types or battery backup durations), varying economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved areas or adapting their offerings to meet local demands. A clear market focus allows for more effective resource allocation, targeted marketing campaigns, and better positioning against local competitors, ultimately driving growth in those targeted areas.

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    Market Overview and Dynamics

    The Europe embedded die packaging technology market is expected to grow from US$ 9,686.92 thousand in 2020 to US$ 35,043.61 thousand by 2028; it is estimated to grow at a CAGR of 17.8 % from 2021 to 2028. Rising adoption of wearable devices and internet of things is expected to escalate the Europe embedded die packaging technology market. In the era of digitalization and the Internet of Things (IoT), the embedded die packaging technology is also offering advanced electronic devices for consumers. Consumer inclination toward smartwatches and IoT devices is likely to propel the Europe market growth. Some of the market players across Europe are introducing advanced wearable electronic gadgets for customers. The new features in smart wearables, such as health monitoring, activity monitoring, and internet connectivity, are improving through embedded die packaging technology. For instance, Apple Watch 4 series implemented the embedded die packaging technology to design a small form factor based structure. Such adoption of embedded die packaging technology in wearables through embedded die packaging technology is supposed to fuel the Europe market growth in the coming years. Besides, the emergence of smart devices based on IoT technology is creating a scope for embedded die packaging technology, to achieve smart assistant, smart hearables, companion robot, smart camera, smart speaker, and other features., which will drive the Europe embedded die packaging technology market.

    Key Market Segments

    In terms of platform, the IC package substrate segment accounted for the largest share of the Europe embedded die packaging technology market in 2020. In terms of application, the smartphone and tablets segment held a larger market share of the Europe embedded die packaging technology market in 2020. Further, the consumer electronics segment held a larger share of the Europe embedded die packaging technology market based on industry in 2020.

    Major Sources and Companies Listed

    A few major primary and secondary sources referred to for preparing this report on the Europe embedded die packaging technology market are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; and Taiwan Semiconductor Manufacturing Company, Limited

    Reasons to buy report

    • To understand the Europe embedded die packaging technology market landscape and identify market segments that are most likely to guarantee a strong return
    • Stay ahead of the race by comprehending the ever-changing competitive landscape for Europe embedded die packaging technology market
    • Efficiently plan M&A and partnership deals in Europe embedded die packaging technology market by identifying market segments with the most promising probable sales
    • Helps to take knowledgeable business decisions from perceptive and comprehensive analysis of market performance of various segment form Europe embedded die packaging technology market
    • Obtain market revenue forecast for market by various segments from 2021-2028 in Europe region.

     

    Europe Embedded Die Packaging Technology Market Segmentation

    Europe Embedded Die Packaging Technology Market - By Platform

    • IC Package Substrate
    • Rigid Board
    • Flexible Board

    Europe Embedded Die Packaging Technology Market -

    By Application

    • Smartphone and Tablets
    • Medical and Wearable Devices
    • Industrial Devices
    • Security Devices
    • Other Applications

    Europe Embedded Die Packaging Technology Market -

    By Industry

    • Consumer Electronics
    • IT and Telecommunication
    • Automotive
    • Healthcare  
    • Other Industries

    Europe Embedded Die Packaging Technology Market - By Country

    • Germany
    • France
    • Italy
    • UK  
    • Russia
    • Rest of Europe  

    Europe Embedded Die Packaging Technology Market - Company Profiles

    • Amkor Technology, Inc.  
    • ASE Group
    • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Fujikura Ltd.
    • General Electric Company
    • Infineon Technologies AG
    • Microsemi
    • Schweizer Electronic AG
    • Taiwan Semiconductor Manufacturing Company, Limited

    The List of Companies - Europe Embedded Die Packaging Technology Market

    1. Amkor Technology, Inc.
    2. ASE Group
    3. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    4. Fujikura Ltd.
    5. General Electric Company
    6. Infineon Technologies AG
    7. Microsemi
    8. Schweizer Electronic AG
    9. Taiwan Semiconductor Manufacturing Company, Limited
    Frequently Asked Questions
    How big is the Europe Embedded Die Packaging Technology Market?

    The Europe Embedded Die Packaging Technology Market is valued at US$ 9,686.92 thousand in 2020, it is projected to reach US$ 35,043.61 thousand by 2028.

    What is the CAGR for Europe Embedded Die Packaging Technology Market by (2021 - 2028)?

    As per our report Europe Embedded Die Packaging Technology Market, the market size is valued at US$ 9,686.92 thousand in 2020, projecting it to reach US$ 35,043.61 thousand by 2028. This translates to a CAGR of approximately 17.8 % during the forecast period.

    What segments are covered in this report?

    The Europe Embedded Die Packaging Technology Market report typically cover these key segments-

    • Platform (IC Package Substrate, Rigid Board, Flexible Board)
    • Application (Smartphone and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, Other Applications)
    • Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, Other Industries)

    What is the historic period, base year, and forecast period taken for Europe Embedded Die Packaging Technology Market?

    The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Europe Embedded Die Packaging Technology Market report:

  • Historic Period : 2018-2019
  • Base Year : 2020
  • Forecast Period : 2021-2028
  • Who are the major players in Europe Embedded Die Packaging Technology Market?

    The Europe Embedded Die Packaging Technology Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:

  • Amkor Technology, Inc.
  • ASE Group
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • General Electric Company
  • Infineon Technologies AG
  • Microsemi
  • Schweizer Electronic AG
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Who should buy this report?

    The Europe Embedded Die Packaging Technology Market report is valuable for diverse stakeholders, including:

    • Investors: Provides insights for investment decisions pertaining to market growth, companies, or industry insights. Helps assess market attractiveness and potential returns.
    • Industry Players: Offers competitive intelligence, market sizing, and trend analysis to inform strategic planning, product development, and sales strategies.
    • Suppliers and Manufacturers: Helps understand market demand for components, materials, and services related to concerned industry.
    • Researchers and Consultants: Provides data and analysis for academic research, consulting projects, and market studies.
    • Financial Institutions: Helps assess risks and opportunities associated with financing or investing in the concerned market.

    Essentially, anyone involved in or considering involvement in the Europe Embedded Die Packaging Technology Market value chain can benefit from the information contained in a comprehensive market report.

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