Europe Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphone and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries)
Market Introduction
Strong adoption of the advanced technology for manufacturing and commercial operations is driving the Europe embedded die packaging market. The automotive sector—led by Germany due to the presence of prominent car manufacturers such as Daimler AG, BMW, VW, Opel, and Audi—is the largest contributor to the market in Europe. As per the European Automobile Manufacturers Association, in 2019, ~15.8 million passenger cars were manufactured in the region; thus, the high investments by car manufacturers in their EV production capabilities is further propelling the market growth in Europe. The region also has a positive outlook for the adoption of IoT solution for increasing the overall industrial output. Apart from the increasing adoption of advanced electronics, increase in the number of aging European population is also creating demand for advanced healthcare devices. The healthcare sector is also developing and introducing innovative devices to meet the customer demands. Advanced technologies such as IoT and AI are further creating demand for microelectronics devices owing to which companies also expanding their footprint in the European market. Mounting developments in embedded die packaging technology and escalating demand for miniaturization of electronic devices are the major factor driving the growth of the Europe embedded die packaging technology market.
In case of COVID-19, Europe is highly affected specially the UK and Russia. Due to increased number of COVID-19 cases, the European market also witnessed a sluggish growth in the embedded die packaging technology in the first half of 2020. The semiconductor industry in Europe resumes growth at a slower rate compared to other markets, such as Asia and the U.S. The demand from industrial and automotive electronics has witnessed a substantial hit than consumer electronics due to the impact of COVID-19 pandemic. Post lockdown market has witnessed healthy growth rate owing to the increasing demand for advanced electronics devices to restart the facilities, operations, commercial places, and transportation.
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Market Overview and Dynamics
The Europe embedded die packaging technology market is expected to grow from US$ 9,686.92 thousand in 2020 to US$ 35,043.61 thousand by 2028; it is estimated to grow at a CAGR of 17.8 % from 2021 to 2028. Rising adoption of wearable devices and internet of things is expected to escalate the Europe embedded die packaging technology market. In the era of digitalization and the Internet of Things (IoT), the embedded die packaging technology is also offering advanced electronic devices for consumers. Consumer inclination toward smartwatches and IoT devices is likely to propel the Europe market growth. Some of the market players across Europe are introducing advanced wearable electronic gadgets for customers. The new features in smart wearables, such as health monitoring, activity monitoring, and internet connectivity, are improving through embedded die packaging technology. For instance, Apple Watch 4 series implemented the embedded die packaging technology to design a small form factor based structure. Such adoption of embedded die packaging technology in wearables through embedded die packaging technology is supposed to fuel the Europe market growth in the coming years. Besides, the emergence of smart devices based on IoT technology is creating a scope for embedded die packaging technology, to achieve smart assistant, smart hearables, companion robot, smart camera, smart speaker, and other features., which will drive the Europe embedded die packaging technology market.
Key Market Segments
In terms of platform, the IC package substrate segment accounted for the largest share of the Europe embedded die packaging technology market in 2020. In terms of application, the smartphone and tablets segment held a larger market share of the Europe embedded die packaging technology market in 2020. Further, the consumer electronics segment held a larger share of the Europe embedded die packaging technology market based on industry in 2020.
Major Sources and Companies Listed
A few major primary and secondary sources referred to for preparing this report on the Europe embedded die packaging technology market are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; and Taiwan Semiconductor Manufacturing Company, Limited
Reasons to buy report
- To understand the Europe embedded die packaging technology market landscape and identify market segments that are most likely to guarantee a strong return
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- Helps to take knowledgeable business decisions from perceptive and comprehensive analysis of market performance of various segment form Europe embedded die packaging technology market
- Obtain market revenue forecast for market by various segments from 2021-2028 in Europe region.
Europe Embedded Die Packaging Technology Market Segmentation
Europe Embedded Die Packaging Technology Market - By Platform
- IC Package Substrate
- Rigid Board
- Flexible Board
Europe Embedded Die Packaging Technology Market - By Application
- Smartphone and Tablets
- Medical and Wearable Devices
- Industrial Devices
- Security Devices
- Other Applications
Europe Embedded Die Packaging Technology Market - By Industry
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Other Industries
Europe Embedded Die Packaging Technology Market - By Country
- Germany
- France
- Italy
- UK
- Russia
- Rest of Europe
Europe Embedded Die Packaging Technology Market - Company Profiles
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- Infineon Technologies AG
- Microsemi
- Schweizer Electronic AG
- Taiwan Semiconductor Manufacturing Company, Limited
1. Introduction
1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 Europe Embedded Die Packaging Technology Market – By Platform
1.3.2 Europe Embedded Die Packaging Technology Market – By Application
1.3.3 Europe Embedded Die Packaging Technology Market – By Industry
1.3.4 Europe Embedded Die Packaging Technology Market- By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. Europe Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 Europe PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinion
5. Europe Embedded Die Packaging Technology Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Escalating Demand for Miniaturization of Electronic Devices
5.1.2 Mounting Developments in Embedded Die Packaging Technology
5.2 Market Restraints
5.2.1 Technical Complexities and Alternative Solutions Availability
5.3 Market Opportunities
5.3.1 Growing Demand to Enhance Smartphone and Automotive Device Performance
5.4 Future Trends
5.4.1 Rising Adoption of Wearable Devices and Internet of Things
5.5 Impact Analysis of Drivers and Restraints
6. Embedded Die Packaging Technology Market – Europe Analysis
6.1 Europe Embedded Die Packaging Technology Market Overview
6.2 Europe Embedded Die Packaging Technology Market –Revenue and Forecast to 2028 (US$ Thousand)
7. Europe Embedded Die Packaging Technology Market Analysis – By Platform
7.1 Overview
7.2 Europe Embedded Die Packaging Technology Market, By Platform (2020 and 2028)
7.3 IC Package Substrate
7.3.1 Overview
7.3.2 IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.4 Rigid Board
7.4.1 Overview
7.4.2 Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.5 Flexible Board
7.5.1 Overview
7.5.2 Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8. Europe Embedded Die Packaging Technology Market – By Application
8.1 Overview
8.2 Europe Embedded Die Packaging Technology Market, by Application (2020 and 2028)
8.3 Smartphone and Tablets
8.3.1 Overview
8.3.2 Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.4 Medical and Wearable Devices
8.4.1 Overview
8.4.2 Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.5 Industrial Devices
8.5.1 Overview
8.5.2 Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.6 Security Devices
8.6.1 Overview
8.6.2 Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.7 Other Applications
8.7.1 Overview
8.7.2 Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9. Europe Embedded Die Packaging Technology Market – By Industry
9.1 Overview
9.2 Europe Embedded Die Packaging Technology Market, by Industry (2020 and 2028)
9.3 Consumer Electronics
9.3.1 Overview
9.3.2 Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.4 IT and Telecommunication
9.4.1 Overview
9.4.2 IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.5 Automotive
9.5.1 Overview
9.5.2 Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.6 Healthcare
9.6.1 Overview
9.6.2 Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.7 Other Industries
9.7.1 Overview
9.7.2 Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10. Europe Embedded Die Packaging Technology Market – Country Analysis
10.1 Overview
10.1.1 Europe: Embedded Die Packaging Technology Market- by Key Country
10.1.1.1 Germany: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.1.1 Germany: Embedded Die Packaging Technology Market- By Platform
10.1.1.1.2 Germany: Embedded Die Packaging Technology Market- By Application
10.1.1.1.3 Germany: Embedded Die Packaging Technology Market- By Industry
10.1.1.2 France: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.2.1 France: Embedded Die Packaging Technology Market- By Platform
10.1.1.2.2 France: Embedded Die Packaging Technology Market- By Application
10.1.1.2.3 France: Embedded Die Packaging Technology Market- By Industry
10.1.1.3 Italy: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.3.1 Italy: Embedded Die Packaging Technology Market- By Platform
10.1.1.3.2 Italy: Embedded Die Packaging Technology Market- By Application
10.1.1.3.3 Italy: Embedded Die Packaging Technology Market- By Industry
10.1.1.4 UK: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.4.1 UK: Embedded Die Packaging Technology Market- By Platform
10.1.1.4.2 UK: Embedded Die Packaging Technology Market- By Application
10.1.1.4.3 UK: Embedded Die Packaging Technology Market- By Industry
10.1.1.5 Russia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.5.1 Russia: Embedded Die Packaging Technology Market- By Platform
10.1.1.5.2 Russia: Embedded Die Packaging Technology Market- By Application
10.1.1.5.3 Russia: Embedded Die Packaging Technology Market- By Industry
10.1.1.6 Rest of Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.6.1 Rest of Europe: Embedded Die Packaging Technology Market- By Platform
10.1.1.6.2 Rest of Europe: Embedded Die Packaging Technology Market- By Application
10.1.1.6.3 Rest of Europe: Embedded Die Packaging Technology Market- By Industry
11. Europe Embedded Die Packaging Technology Market- COVID-19 Impact Analysis
11.1 Europe
12. Industry Landscape
12.1 Overview
12.2 Market Initiative
12.3 New Product Development
13. Company Profiles
13.1 ASE Group
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Amkor Technology, Inc.
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 Fujikura Ltd.
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 General Electric Company
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 Infineon Technologies AG
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Microsemi
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Schweizer Electronic AG
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 Taiwan Semiconductor Manufacturing Company, Limited
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
14. Appendix
14.1 About The Insight Partners
14.2 Word Index
LIST OF TABLES
Table 1. Europe Embedded Die Packaging Technology Market – Revenue, and Forecast to 2028 (US$ Thousand)
Table 2. Germany: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 3. Germany: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 4. Germany: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 5. France: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 6. France: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 7. France: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 8. Italy: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 9. Italy: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 10. Italy: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 11. UK: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 12. UK: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 13. UK: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 14. Russia: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 15. Russia: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 16. Russia: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 17. Rest of Europe: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 18. Rest of Europe: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 19. Rest of Europe: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 20. List of Abbreviation
LIST OF FIGURES
Figure 1. Europe Embedded Die Packaging Technology Market Segmentation
Figure 2. Europe Embedded Die Packaging Technology Market Segmentation – By Country
Figure 3. Europe Embedded Die Packaging Technology Market Overview
Figure 4. IC Package Substrate Platform Held the Largest Market Share in 2020
Figure 5. Smartphones and Tablets Held the Largest Market Share in 2020
Figure 6. Consumer Electronics Held the Largest Market Share in 2020
Figure 7. Germany was the Largest Revenue Contributor in 2020
Figure 8. Europe – PEST Analysis
Figure 9. Europe Embedded Die Packaging Technology Market– Ecosystem Analysis
Figure 10. Expert Opinion
Figure 11. Europe Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints
Figure 12. Europe Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 13. Europe Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)
Figure 14. Europe IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 15. Europe Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 16. Europe Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 17. Europe Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)
Figure 18. Europe Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 19. Europe Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 20. Europe Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 21. Europe Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 22. Europe Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 23. Europe Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)
Figure 24. Europe Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 25. Europe IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 26. Europe Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 27. Europe Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 28. Europe Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 29. Europe: Embedded Die Packaging Technology Market, by Key Country – Revenue (2020) (USD Thousand)
Figure 30. Europe: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)
Figure 31. Germany: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 32. France: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 33. Italy: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 34. UK: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 35. Russia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 36. Rest of Europe: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 37. Impact of COVID-19 Pandemic in Europe Country Markets
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- Infineon Technologies AG
- Microsemi
- Schweizer Electronic AG
- Taiwan Semiconductor Manufacturing Company, Limited
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