Europe Embedded Die Packaging Technology Market
Strong adoption of the advanced technology for manufacturing and commercial operations is driving the Europe embedded die packaging market. The automotive sector—led by Germany due to the presence of prominent car manufacturers such as Daimler AG, BMW, VW, Opel, and Audi—is the largest contributor to the market in Europe. As per the European Automobile Manufacturers Association, in 2019, ~15.8 million passenger cars were manufactured in the region; thus, the high investments by car manufacturers in their EV production capabilities is further propelling the market growth in Europe. The region also has a positive outlook for the adoption of IoT solution for increasing the overall industrial output. Apart from the increasing adoption of advanced electronics, increase in the number of aging European population is also creating demand for advanced healthcare devices. The healthcare sector is also developing and introducing innovative devices to meet the customer demands. Advanced technologies such as IoT and AI are further creating demand for microelectronics devices owing to which companies also expanding their footprint in the European market. Mounting developments in embedded die packaging technology and escalating demand for miniaturization of electronic devices are the major factor driving the growth of the Europe embedded die packaging technology market.
In case of COVID-19, Europe is highly affected specially the UK and Russia. Due to increased number of COVID-19 cases, the European market also witnessed a sluggish growth in the embedded die packaging technology in the first half of 2020. The semiconductor industry in Europe resumes growth at a slower rate compared to other markets, such as Asia and the U.S. The demand from industrial and automotive electronics has witnessed a substantial hit than consumer electronics due to the impact of COVID-19 pandemic. Post lockdown market has witnessed healthy growth rate owing to the increasing demand for advanced electronics devices to restart the facilities, operations, commercial places, and transportation.
Strategic insights for the Europe Embedded Die Packaging Technology provides data-driven analysis of the industry landscape, including current trends, key players, and regional nuances. These insights offer actionable recommendations, enabling readers to differentiate themselves from competitors by identifying untapped segments or developing unique value propositions. Leveraging data analytics, these insights help industry players anticipate the market shifts, whether investors, manufacturers, or other stakeholders. A future-oriented perspective is essential, helping stakeholders anticipate market shifts and position themselves for long-term success in this dynamic region. Ultimately, effective strategic insights empower readers to make informed decisions that drive profitability and achieve their business objectives within the market.
| Report Attribute | Details |
|---|---|
| Market size in 2020 | US$ 9,686.92 thousand |
| Market Size by 2028 | US$ 35,043.61 thousand |
| Global CAGR (2021 - 2028) | 17.8 % |
| Historical Data | 2018-2019 |
| Forecast period | 2021-2028 |
| Segments Covered |
By Platform
|
| Regions and Countries Covered | Europe
|
| Market leaders and key company profiles |
The geographic scope of the Europe Embedded Die Packaging Technology refers to the specific areas in which a business operates and competes. Understanding local distinctions, such as diverse consumer preferences (e.g., demand for specific plug types or battery backup durations), varying economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved areas or adapting their offerings to meet local demands. A clear market focus allows for more effective resource allocation, targeted marketing campaigns, and better positioning against local competitors, ultimately driving growth in those targeted areas.
The Europe embedded die packaging technology market is expected to grow from US$ 9,686.92 thousand in 2020 to US$ 35,043.61 thousand by 2028; it is estimated to grow at a CAGR of 17.8 % from 2021 to 2028. Rising adoption of wearable devices and internet of things is expected to escalate the Europe embedded die packaging technology market. In the era of digitalization and the Internet of Things (IoT), the embedded die packaging technology is also offering advanced electronic devices for consumers. Consumer inclination toward smartwatches and IoT devices is likely to propel the Europe market growth. Some of the market players across Europe are introducing advanced wearable electronic gadgets for customers. The new features in smart wearables, such as health monitoring, activity monitoring, and internet connectivity, are improving through embedded die packaging technology. For instance, Apple Watch 4 series implemented the embedded die packaging technology to design a small form factor based structure. Such adoption of embedded die packaging technology in wearables through embedded die packaging technology is supposed to fuel the Europe market growth in the coming years. Besides, the emergence of smart devices based on IoT technology is creating a scope for embedded die packaging technology, to achieve smart assistant, smart hearables, companion robot, smart camera, smart speaker, and other features., which will drive the Europe embedded die packaging technology market.
In terms of platform, the IC package substrate segment accounted for the largest share of the Europe embedded die packaging technology market in 2020. In terms of application, the smartphone and tablets segment held a larger market share of the Europe embedded die packaging technology market in 2020. Further, the consumer electronics segment held a larger share of the Europe embedded die packaging technology market based on industry in 2020.
A few major primary and secondary sources referred to for preparing this report on the Europe embedded die packaging technology market are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; and Taiwan Semiconductor Manufacturing Company, Limited
The Europe Embedded Die Packaging Technology Market is valued at US$ 9,686.92 thousand in 2020, it is projected to reach US$ 35,043.61 thousand by 2028.
As per our report Europe Embedded Die Packaging Technology Market, the market size is valued at US$ 9,686.92 thousand in 2020, projecting it to reach US$ 35,043.61 thousand by 2028. This translates to a CAGR of approximately 17.8 % during the forecast period.
The Europe Embedded Die Packaging Technology Market report typically cover these key segments-
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Europe Embedded Die Packaging Technology Market report:
The Europe Embedded Die Packaging Technology Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
The Europe Embedded Die Packaging Technology Market report is valuable for diverse stakeholders, including:
Essentially, anyone involved in or considering involvement in the Europe Embedded Die Packaging Technology Market value chain can benefit from the information contained in a comprehensive market report.
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