Share, Trend, and Growth Opportunity Analysis Report Coverage: By Product (Paste, Bar, Wire, Spheres, and Others) and Process (Printer, Laser, Wave, Reflow, and Others)
No. of Pages:
159
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Report Code:
BMIRE00030050
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Category:
Chemicals and Materials
EMEA and APAC solder materials market is expected to grow from US$ 4.73 billion in 2022 and is projected to reach US$ 6.72 billion by 2030. It is expected to grow at a CAGR of 4.5% from 2022 to 2030.
The solder material encompasses a wide range of products employed in electronics assembly and soldering processes. These materials are crucial in constructing reliable electrical connections between electronic components and circuit boards. The expanding electronics industry, fueled by increasing demand for consumer electronics such as tablets, laptops, and smartphones, is causing the solder materials market. The Europe, Middle East & Africa, and Asia Pacific (EMEA and APAC) solder materials market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication. Furthermore, the trend towards miniaturization and more compact electronic devices requires solder materials capable of forming fine-pitch connections with high reliability. The ongoing research concerning the development of innovative solder materials such as low-temperature solder alloys and no-clean fluxes is a concern for the evolving industry.
Based on product, the EMEA and APAC solder materials market is segmented into paste, bar, wire, spheres, and others. The paste segment is expected to be the fastest-growing segment from 2022 to 2030. Solder paste is used in the electronics industry for surface mount assembly processes. It is a mixture of powdered metals and flux. When heated during soldering, the paste melts, forming a bond between the components and the circuit board. It is used in through-hole pin-in paste components by printing solder paste in/over the holes. The solder paste is applied to the board by stencil printing or jet printing, and the components are put in place through a pick-and-place machine or by hand. However, the right amount of paste is necessary for these processes. During PCB production, printed circuit board (PCB) manufacturers usually test the solder paste deposits through solder paste inspection. The inspection systems measure the volume of the solder pads before the components are applied and the solder is melted.
Further, businesses across almost all industry verticals have realized the importance of communications, IoT, and sensors and have paved the way for integrating sensors into the devices. Numerous business functions such as supply chain planning and logistics and manufacturing across industry verticals such as automotive, healthcare, consumer electronic devices, and aerospace & defense can be optimized, thus enabling increased profitability. The positive impact on the companies' balance sheets due to the integration of sensor-enabled devices into the business processes has led to enormous demands for more such devices. Huge demands are further anticipated to burden the semiconductor industry. Therefore, the growth of solder materials in various IC manufacturing is anticipated to rise rapidly during the forecast period, with IoT gaining more prominence in the coming years. The materials meet standard soldering requirements but also align with the specialized needs of IoT devices, including resistance to environmental factors, temperature variations, and long-term durability. The intricated and diverse nature of IoT applications is anticipated to fuel the growth of the solder materials market as manufacturers adapt and innovate to meet the evolving demands of this dynamic industry.
Indium Corp, Fusion Inc, Element Solutions Inc, KOKI Co Ltd, Stannol GmbH & Co KG, AIM Metals & Alloys LP, Nihon Superior Co Ltd, GENMA Europe GmbH, and National Solder Co Ltd, are among the leading players in the EMEA and APAC solder materials market. These companies are adopting mergers & acquisitions and product launches to expand their geographic presence and consumer bases.
The overall EMEA and APAC solder materials market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the market. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain more analytical insights. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers-along with external consultants, including valuation experts, research analysts, and key opinion leaders-specializing in the EMEA and APAC solder materials market.
EMEA and APAC Solder Materials Strategic Insights
Strategic insights for the EMEA and APAC Solder Materials provides data-driven analysis of the industry landscape, including current trends, key players, and regional nuances. These insights offer actionable recommendations, enabling readers to differentiate themselves from competitors by identifying untapped segments or developing unique value propositions. Leveraging data analytics, these insights help industry players anticipate the market shifts, whether investors, manufacturers, or other stakeholders. A future-oriented perspective is essential, helping stakeholders anticipate market shifts and position themselves for long-term success in this dynamic region. Ultimately, effective strategic insights empower readers to make informed decisions that drive profitability and achieve their business objectives within the market.
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EMEA and APAC Solder Materials Report Scope
Report Attribute
Details
Market size in 2022
US$ 4.73 Billion
Market Size by 2030
US$ 6.72 Billion
Global CAGR (2022 - 2030)
4.5%
Historical Data
2020-2021
Forecast period
2023-2030
Segments Covered
By Product
Paste
Bar
Wire
Spheres
By Process
Printer
Laser
Wave
Reflow
Regions and Countries Covered
Europe
UK
Germany
France
Russia
Italy
Rest of Europe
Middle East and Africa
South Africa
Saudi Arabia
UAE
Rest of Middle East and Africa
Asia-Pacific
China
India
Japan
Australia
Rest of Asia-Pacific
Market leaders and key company profiles
AIM Metals & Alloys LP
KOKI Co Ltd
Fusion Inc
Stannol GmbH & Co KG
National Solder Co (PTY) Ltd
Nihon Superior Co Ltd
GENMA Europe GmbH
Indium Corp
Element Solutions Inc
Harima Chemicals Group Inc
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EMEA and APAC Solder Materials Regional Insights
The geographic scope of the EMEA and APAC Solder Materials refers to the specific areas in which a business operates and competes. Understanding local distinctions, such as diverse consumer preferences (e.g., demand for specific plug types or battery backup durations), varying economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved areas or adapting their offerings to meet local demands. A clear market focus allows for more effective resource allocation, targeted marketing campaigns, and better positioning against local competitors, ultimately driving growth in those targeted areas.
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Identical Market Reports with other Region/Countries
The List of Companies - EMEA and APAC Solder Materials Market
The List of Companies - EMEA and APAC Solder Materials Market
AIM Metals & Alloys LP
KOKI Co Ltd?
Fusion Inc
Stannol GmbH & Co KG?
National Solder Co (PTY) Ltd
Nihon Superior Co Ltd
GENMA Europe GmbH?
Indium Corp?
Element Solutions Inc?
Harima Chemicals Group Inc
Frequently Asked Questions
How big is the EMEA and APAC Solder Materials Market?
The EMEA and APAC Solder Materials Market is valued at US$ 4.73 Billion in 2022, it is projected to reach US$ 6.72 Billion by 2030.
What is the CAGR for EMEA and APAC Solder Materials Market by (2022 - 2030)?
As per our report EMEA and APAC Solder Materials Market, the market size is valued at US$ 4.73 Billion in 2022, projecting it to reach US$ 6.72 Billion by 2030. This translates to a CAGR of approximately 4.5% during the forecast period.
What segments are covered in this report?
The EMEA and APAC Solder Materials Market report typically cover these key segments-
Product (Paste, Bar, Wire, Spheres)
Process (Printer, Laser, Wave, Reflow)
What is the historic period, base year, and forecast period taken for EMEA and APAC Solder Materials Market?
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the EMEA and APAC Solder Materials Market report:
Historic Period : 2020-2021
Base Year : 2022
Forecast Period : 2023-2030
Who are the major players in EMEA and APAC Solder Materials Market?
The EMEA and APAC Solder Materials Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
AIM Metals & Alloys LP
KOKI Co Ltd
Fusion Inc
Stannol GmbH & Co KG
National Solder Co (PTY) Ltd
Nihon Superior Co Ltd
GENMA Europe GmbH
Indium Corp
Element Solutions Inc
Harima Chemicals Group Inc
Who should buy this report?
The EMEA and APAC Solder Materials Market report is valuable for diverse stakeholders, including:
Investors: Provides insights for investment decisions pertaining to market growth, companies, or industry insights. Helps assess market attractiveness and potential returns.
Industry Players: Offers competitive intelligence, market sizing, and trend analysis to inform strategic planning, product development, and sales strategies.
Suppliers and Manufacturers: Helps understand market demand for components, materials, and services related to concerned industry.
Researchers and Consultants: Provides data and analysis for academic research, consulting projects, and market studies.
Financial Institutions: Helps assess risks and opportunities associated with financing or investing in the concerned market.
Essentially, anyone involved in or considering involvement in the EMEA and APAC Solder Materials Market value chain can benefit from the information contained in a comprehensive market report.
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WHAT'S INCLUDED IN FULL REPORT : Market Dynamics,
Competitive Analysis and Assessment, Define Business Strategies, Market Outlook and
Trends, Market Size and Share Analysis, Growth Driving Factors, Future Commercial
Potential, Identify Regional Growth Engines