Asia Pacific Substrate like PCB Market

The Asia Pacific substrate like PCB market is expected to reach US$ 3,922.8 million by 2028 from US$ 1,180.2 million in 2021. The market is estimated to grow at a CAGR of 18.7% from 2021–2028.

Smartphones have evolved from 4G LTE to 5G, and the complexity of Massive MIMO antenna configurations has made RF front-ends take up more space in 5G smartphones. In addition, the amount of data processed by the 5G system is expected to grow geometrically shortly, increasing the requirement for high battery capacity, which means that PCBs and other electronic components must be compressed to achieve higher density and smaller form factor, which has pushed substrate-like PCB toward thinner, smaller, and more complex processes. Substrate-like PCB (SLP PCB) is the next generation of high-density PCB, which requires trace/spacing equal to or less than 30/30 μm (now 40/40 μm is the limit for HDI), for further reducing the device size, leaving more space for other components. The rising adoption of SLP by smartphone players due to the transition from 4G to 5G technology provides a massive opportunity to the Asia Pacific substrate-like PCB market. The expansion in 5G infrastructure is expected to increase the demand for PCBs and substrates for mainboards and modules in various end-use industries, such as consumer electronics, automotive, medical, industrial, telecommunication, and others.

APAC is a crucial region in terms of manufacturing and industrial growth and any disruptions may negatively impact the growth of various industries. With the COVID-19 outbreak, the IC substrate production came to an abrupt end in China from February 2020 to March 2020. Thus, this influenced the demand for the product, worldwide, and influenced the price. The governments of various countries of this region are taking drastic measures to reduce the effects of coronavirus outbreaks by announcing lockdowns, travel and trade bans. All these measures hurt the adoption and growth of substrate-like PCB till Mid-2021.

With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the substrate like PCB market. The Asia Pacific substrate like PCB market is expected to grow at a good CAGR during the forecast period.

Asia Pacific Substrate like PCB Market Revenue and Forecast to 2028 (US$ Million)

Asia Pacific Substrate like PCB Market Segmentation     

By Line/Space

• 25/25 and 30/30 um
• Less than 25/25 um

By Inspection Technology

•  Automated Optical Inspection
• Direct Imaging
• Automated Optical Shaping

By Application

•  Consumer electronics
• Automotive
• Medical
• Industrial
• Others

By Country

• Asia Pacific
• China
• Japan
• India
• Australia
• South Korea
• Vietnam
• Rest of APAC

Companies Mentioned

• Compaq Manufacturing Co., Ltd.
• DAEDUCK ELECTRONICS CO., LTD.
• Ibiden Co, Ltd.
• Kinsus Interconnect Technology
• SAMSUNG ELECTRO-MECHANICS CO, Ltd
• AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
• Zhen Ding Tech. Group Technology Holding Limited
• Technologies Inc.
• Korea Circuit
• Unimicron Technology Corp.

Asia Pacific Substrate like PCB Strategic Insights

Strategic insights for the Asia Pacific Substrate like PCB provides data-driven analysis of the industry landscape, including current trends, key players, and regional nuances. These insights offer actionable recommendations, enabling readers to differentiate themselves from competitors by identifying untapped segments or developing unique value propositions. Leveraging data analytics, these insights help industry players anticipate the market shifts, whether investors, manufacturers, or other stakeholders. A future-oriented perspective is essential, helping stakeholders anticipate market shifts and position themselves for long-term success in this dynamic region. Ultimately, effective strategic insights empower readers to make informed decisions that drive profitability and achieve their business objectives within the market.

Asia Pacific Substrate like PCB Report Scope

Asia Pacific Substrate like PCB Regional Insights

The geographic scope of the Asia Pacific Substrate like PCB refers to the specific areas in which a business operates and competes. Understanding local distinctions, such as diverse consumer preferences (e.g., demand for specific plug types or battery backup durations), varying economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved areas or adapting their offerings to meet local demands. A clear market focus allows for more effective resource allocation, targeted marketing campaigns, and better positioning against local competitors, ultimately driving growth in those targeted areas.