Asia Pacific Semiconductor Bonding Market

The semiconductor bonding market in Asia Pacific is expected to grow from US$ 274.55 million in 2022 to US$ 469.89 million by 2028. It is estimated to grow at a CAGR of 9.4% from 2022 to 2028.

Adoption of Die Bonding in Telecommunication

The growing demand for high-performance optical communication devices boosts 5G deployment and datacenter applications. Further, this supports 5G wireless fronthaul and next-generation Ethernet modules, which include 2x200GbE, 4x100GbE, 400GbE, and CWDM/DWDM transceivers. The demand for high-performance optical devices is also generating requirements for smaller packaging housing, rapid technology innovation, smaller chips/dies with higher density in the package, higher-volume manufacturing, quick product iterations, and an economical price point. The new requirements are also needed in lidar, AR/VR, advanced photonic sensors, MEMS, and highly integrated silicon photonics devices. For manufacturing all the above devices, successfully deploying flexible die bonding solutions with high post-bonding accuracy and great long-term stability is required. Various manufacturers are producing flexible high bonding solutions to meet this requirement. For instance, MRSI-HVM by MRSI Systems is a flexible high-speed die bonder which can achieve <±1.5 µm @ 3 sigma. Thus, with this, the company provides the best manufacturing solution for increasing volume and mix in manufacturing 5G and datacenter core devices.

Market Overview

Australia, China, India, Japan, South Korea, and rest of Asia Pacific are the key contributors to the semiconductor bonding market in the Asia Pacific. The market growth is attributed to the presence of several OSAT (Outsourced Semiconductor Assembly and Test) players in Taiwan and China. In February 2021, SMIC (Semiconductor Manufacturing International Co) announced the total investment of US$ 9.06 billion in Shanghai wafer plant with the government-backed China Integrated Circuit Industry Investment Fund. Similarly, in June 2020, GlobalWafers Co., Ltd invested US$ 339 million in its Taisil (Taiwan) branch to upsurge 300-mm silicon wafer capabilities. This enhanced capacity is projected to meet the growing demand for high-quality silicon wafers. Such developments in the region are driving the demand for wafer bonding devices. ASM Pacific Technology; DIAS Automation (HK) Ltd; Kulicke and Soffa Industries, Inc; Panasonic Corporation; SHINKAWA Electric Co., Ltd; and TORAY ENGINEERING Co. Ltd are a few of the prominent companies operating in the Asia Pacific semiconductor bonding market. These companies are majorly focusing on the market for MEMS sensors, LED sensors, and CMOS image sensors. The increasing number of Integrated Device Manufacturer (IDMs) and bulk manufacturing of electronic devices such as smart watches, mobile phones, and household appliances in China and Taiwan is projected to boost the market growth. For example, HANIMI Semiconductor Co. Ltd has launched its new Flip Chip Bonder-5.0. Its major focus is on high-end semiconductor production, which is propelling the demand for semiconductor bonding.

 Asia Pacific Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)

Asia Pacific Semiconductor Bonding Strategic Insights

Strategic insights for the Asia Pacific Semiconductor Bonding provides data-driven analysis of the industry landscape, including current trends, key players, and regional nuances. These insights offer actionable recommendations, enabling readers to differentiate themselves from competitors by identifying untapped segments or developing unique value propositions. Leveraging data analytics, these insights help industry players anticipate the market shifts, whether investors, manufacturers, or other stakeholders. A future-oriented perspective is essential, helping stakeholders anticipate market shifts and position themselves for long-term success in this dynamic region. Ultimately, effective strategic insights empower readers to make informed decisions that drive profitability and achieve their business objectives within the market.

Asia Pacific Semiconductor Bonding Report Scope

Asia Pacific Semiconductor Bonding Regional Insights

The geographic scope of the Asia Pacific Semiconductor Bonding refers to the specific areas in which a business operates and competes. Understanding local distinctions, such as diverse consumer preferences (e.g., demand for specific plug types or battery backup durations), varying economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved areas or adapting their offerings to meet local demands. A clear market focus allows for more effective resource allocation, targeted marketing campaigns, and better positioning against local competitors, ultimately driving growth in those targeted areas.

Asia Pacific Semiconductor Bonding Market Segmentation

The Asia Pacific semiconductor bonding market is segmented into type, application, and country.

• Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
• Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022.
• Based on country, the market is segmented into Australia, China, India, Japan, South Korea, and rest of Asia Pacific. Rest of Asia Pacific dominated the market share in 2022.

ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the Asia Pacific region.