Asia Pacific Embedded Die Packaging Technology Market
No. of Pages: 130 | Report Code: TIPRE00022130 | Category: Electronics and Semiconductor
No. of Pages: 130 | Report Code: TIPRE00022130 | Category: Electronics and Semiconductor
Taiwan and China are the leading semiconductor manufacturing countries in APAC. Rising disposable income in developing countries, such as India and China are leading to a large client base for high-tech consumer electronics such as smart wearables, smartphones, and electric vehicles. This factor is expected to drive the embedded die packaging technology market growth. China is a leading manufacturing hub for the IC packaging technology-based products, while Taiwan, South Korea, and Japan are also significant contributors to the regional market growth. Many of the APAC countries are characterized by the mass production of electronic devices required for consumer electronics, automotive components, telecommunication devices, and other industrial machineries. Rising number of electronics manufacturing companies in India and China owing to strong availability of skilled human resources is driving the embedded die packaging technology market growth. According to the Cisco annual internet report, Asia Pacific would mark ~3.1 billion Internet users by 2023. Further, according to the Ericsson Mobility Report, their mobile connections in Asia Pacific are expected rise from ~4 billion to 4.6 billion by 2021. Increase in smartphones and advanced internet connecting devices is anticipated to support the adoption of the embedded die packaging technology in components such as ICs, RF modules, and processors.
In case of COVID-19, APAC is highly affected specially India. Countries such as China, India, South Korea, and Japan are moving toward new networking solutions such as 5G, 4G, and VoLTE. China and India are the most prominent manufacturing hub in the region and have an enhanced focus on industrialization. The growth of the manufacturing industry has been hampered due to lockdown but soon recovered the development by enhancing the production capabilities in the second half of the year. The demand for advanced electronics such as a smartwatch, smart wearables, and healthcare machines has risen significantly. Also, companies in the Asian region have restructured their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, in 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea
Strategic insights for the Asia Pacific Embedded Die Packaging Technology provides data-driven analysis of the industry landscape, including current trends, key players, and regional nuances. These insights offer actionable recommendations, enabling readers to differentiate themselves from competitors by identifying untapped segments or developing unique value propositions. Leveraging data analytics, these insights help industry players anticipate the market shifts, whether investors, manufacturers, or other stakeholders. A future-oriented perspective is essential, helping stakeholders anticipate market shifts and position themselves for long-term success in this dynamic region. Ultimately, effective strategic insights empower readers to make informed decisions that drive profitability and achieve their business objectives within the market.
| Report Attribute | Details |
|---|---|
| Market size in 2020 | US$ 32,019.28 thousand |
| Market Size by 2028 | US$ 1,21,957.05 thousand |
| Global CAGR (2021 - 2028) | 18.5 % |
| Historical Data | 2018-2019 |
| Forecast period | 2021-2028 |
| Segments Covered |
By Platform
|
| Regions and Countries Covered | Asia-Pacific
|
| Market leaders and key company profiles |
The geographic scope of the Asia Pacific Embedded Die Packaging Technology refers to the specific areas in which a business operates and competes. Understanding local distinctions, such as diverse consumer preferences (e.g., demand for specific plug types or battery backup durations), varying economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved areas or adapting their offerings to meet local demands. A clear market focus allows for more effective resource allocation, targeted marketing campaigns, and better positioning against local competitors, ultimately driving growth in those targeted areas.
The APAC embedded die packaging technology market is expected to grow from US$ 32,019.28 thousand in 2020 to US$ 1,21,957.05 thousand by 2028; it is estimated to grow at a CAGR of 18.5 % from 2021 to 2028. Burgeoning demand for miniaturization of electronic devices is expected to surge the APAC embedded die packaging technology market. The growing trend of the small form factor-based handheld electronic devices is one of the significant factors accelerating the APAC market growth. Technological advancements, such as miniaturization, in electronics forming have influenced various markets including military, aerospace, medical, retail, and consumer electronics. Devices with small form factor-based packages embed more functionality and are considered the best alternative for traditional packaging systems. Personalized healthcare gadgets, thin-sized smartphones, and compact PCs are equipped with embedded die packaging technology-based components, such as ICs, processors, sensors, and RF modules. Continuous development in advanced packaging technologies, including flexible boards and IC package substrate, further supplement the APAC market growth by resolving the technical challenges. Innovations in solutions such as multi-die integration and flexible ICs enhance device performance by offering small form factors. New packaging technologies are aiding the integration of multiple components in a single die. Moreover, market players across APAC region are making efforts to optimize the embedded die packaging technology for better solution formation. The embedded die packaging technology is used to form chiplets with high bandwidth and low power consumption. So the miniaturization of electronics devices is expected to increase the demand of embedded die packaging technology, which will drive the APAC embedded die packaging technology market.
In terms of platform, the IC package substrate segment accounted for the largest share of the APAC embedded die packaging technology market in 2020. In terms of application, the smartphone and tablets segment held a larger market share of the APAC embedded die packaging technology market in 2020. Further, the consumer electronics segment held a larger share of the APAC embedded die packaging technology market based on industry in 2020.
A few major primary and secondary sources referred to for preparing this report on the APAC embedded die packaging technology market are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd.; and Taiwan Semiconductor Manufacturing Company, Limited
The Asia Pacific Embedded Die Packaging Technology Market is valued at US$ 32,019.28 thousand in 2020, it is projected to reach US$ 1,21,957.05 thousand by 2028.
As per our report Asia Pacific Embedded Die Packaging Technology Market, the market size is valued at US$ 32,019.28 thousand in 2020, projecting it to reach US$ 1,21,957.05 thousand by 2028. This translates to a CAGR of approximately 18.5 % during the forecast period.
The Asia Pacific Embedded Die Packaging Technology Market report typically cover these key segments-
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific Embedded Die Packaging Technology Market report:
The Asia Pacific Embedded Die Packaging Technology Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
The Asia Pacific Embedded Die Packaging Technology Market report is valuable for diverse stakeholders, including:
Essentially, anyone involved in or considering involvement in the Asia Pacific Embedded Die Packaging Technology Market value chain can benefit from the information contained in a comprehensive market report.
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