At 12.9% CAGR, the North America Redistribution Layer Material Market is Projected to be Worth US$ 58.86 Million by 2030, Says Business Market Insights

According to Business Market Insights' research, the North America redistribution layer material market was valued at US$ 22.34 million in 2022 and is expected to reach US$ 58.86 million by 2030, registering a CAGR of 12.9% from 2022 to 2030. Increasing demand from automotive and telecommunication industries and growing focus on ai-based equipment and tools are among the critical factors attributed to the North America redistribution layer material market expansion.

The North America redistribution layer material market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication.

The telecommunication sector is evolving rapidly, particularly with the deployment of 5G technology. There is a widespread rollout of 5G networks in across the globe, which has led to an increased demand for smartphones and other consumer electronics products. For instance, in October 2021, AIS and Samsung jointly launched a voice-over 5G radio service enabling voice calls on AIS's 5G standalone (SA) network in Thailand. In Vietnam, Samsung Electronics and Viettel announced the 5G commercial trials launched in Da Nang in December 2021. Viettel is piloting 5G services in 11 provinces and cities, namely, Ho Chi Minh City, Hanoi, Bac Ninh, Vinh Phuc, Bac Giang, Dong Nai, Ba Ria-Vung Tau, Binh Phuoc, Thua Thien-Hue, and Da Nang. In addition, according to Viavi Solutions Inc.'s report, over 92 countries across the world have launched 5G networks. A further 23 countries have underway pre-commercial 5G network trials, and 32 nations have announced their 5G rollout plans. The widespread rollout of 5G networks has led to an increased demand for smartphones and other consumer electronics products. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. Smaller, more powerful devices are in demand, necessitating thinner and more advanced redistribution layer materials. These materials play a critical role in enabling high-density interconnections within compact electronic packages. The economic growth of the automotive and telecommunications sectors across the globe has a ripple effect on the entire supply chain. Investments in research and development, technology, and infrastructure are increasing, fostering an environment conducive to innovation and development in the field of redistribution layer materials. This trend is characterized by increased production, advanced packaging technologies, miniaturization requirements, the region's strategic supply chain position, and a positive economic impact on the entire ecosystem. These factors collectively propel the North America redistribution layer material market.

On the contrary, fluctuation in raw material prices hampers the growth of North America redistribution layer material market.

Based on type, the North America redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held 43.0% share of the North America redistribution layer material market in 2022, amassing US$ 9.60 million. It is projected to garner US$ 24.12 million by 2030 to expand at 12.2% CAGR during 2022-2030.

By application, the North America redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held 71.9% share of the North America redistribution layer material market in 2022, amassing US$ 16.06 million. It is projected to garner US$ 43.75 million by 2030 to expand at 13.3% CAGR during 2022-2030.

Based on country, the North America redistribution layer material market is segmented into the US, Canada, and Mexico. The US held 87.6% share of North America redistribution layer material market in 2022, amassing US$ 19.57 million. It is projected to garner US$ 52.79 million by 2030 to expand at 13.2% CAGR during 2022-2030.

Key players operating in the North America redistribution layer material market are SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd, among others.




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