Smartphone and Tablets Segment to Dominate Europe Embedded Die Packaging Technology Market during 2020–2028

  According to a new market research study on “Europe Embedded Die Packaging Technology Market to 2028 – COVID-19 Impact and Regional Analysis and Forecast by Platform, Application, and Industry,” is expected to reach US$ 35,043.61 thousand by 2028 from US$ 9,686.92 thousand in 2020. The market is estimated to grow at a CAGR of 17.8 % from 2021 to 2028. The report provides trends prevailing in the Europe embedded die packaging technology market along with the drivers and restraints pertaining to the market growth. Mounting developments in embedded die packaging technology and escalating demand for miniaturization of electronic devices are the major factor driving the growth of the Europe embedded die packaging technology market. However, technical complexities and alternative solutions availability hinder the growth of Europe embedded die packaging technology market.

In case of COVID-19, Europe is highly affected specially the UK and Russia. Due to increased number of COVID-19 cases, the European market also witnessed a sluggish growth in the embedded die packaging technology in the first half of 2020. The semiconductor industry in Europe resumes growth at a slower rate compared to other markets, such as Asia and the U.S. The demand from industrial and automotive electronics has witnessed a substantial hit than consumer electronics due to the impact of COVID-19 pandemic. Post lockdown market has witnessed healthy growth rate owing to the increasing demand for advanced electronics devices to restart the facilities, operations, commercial places, and transportation.

The Europe embedded die packaging technology market is divided in four segments: platform, application, industry, and country. Based on platform, the market is sub-segmented into IC package substrate, rigid board, and flexible board. The IC package substrate segment dominated the market in 2020 and   is also expected to be fastest growing during forecast period. Based on application, the market is segmented into smartphones and tablets, medical and wearable devices, industrial devices, security devices, and other applications. The smartphones and tablets segment dominated the market in 2020, and medical and wearable devices segment is expected to fastest be growing during forecast period. Based on industry, the market is segmented as automotive, healthcare, consumer electronics, IT and telecommunication, and other industries. The consumer electronics segment dominated the market in 2020 and automotive segment is expected to be fastest growing during forecast period.

Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; and Taiwan Semiconductor Manufacturing Company, Limited are among the leading companies in the Europe embedded die packaging technology market. The companies are focused on adopting organic growth strategies such as product launches and expansions to sustain their position in the dynamic market. For instance, in 2017, General electric formed agreement with Samsung Electro-Mechanics (SEMCO) under which SEMCO patented GE microelectronics packaging portfolio covering substrates embedded with electronic circuits.

The report segments the Europe Embedded Die Packaging Technology Market as follows:

Europe Embedded Die Packaging Technology Market – By Platform

• IC Package Substrate
• Rigid Board
• Flexible Board

Europe Embedded Die Packaging Technology Market – By Application

• Smartphone and Tablets
• Medical and Wearable Devices
• Industrial Devices
• Security Devices
• Other Applications

Europe Embedded Die Packaging Technology Market – By Industry

• Consumer Electronics
• IT and Telecommunication
• Automotive
• Healthcare
• Other Industries

Europe Embedded Die Packaging Technology Market – By Country

• Germany
• France
• Italy
• UK 
• Russia
• Rest of Europe