Report : Asia Pacific RF Front-End Chip Market Forecast to 2030 - Regional Analysis - by Component (Power Amplifier, Radio Frequency Filter, Low Noise Amplifier, RF Switch, and Others) and Application (Consumer Electronics, Wireless Communication, and Others)

At 13.7% CAGR, Asia Pacific RF Front-End Chip Market is Projected to be Worth US$ 21,117.24 Million by 2030, says Business Market Insights

According to Business Market Insights' research, the Asia Pacific RF front-end chip market was valued at US$ 7,548.09 million in 2022 and is projected to reach US$ 21,117.24 million by 2030, registering a CAGR of 13.7% from 2022 to 2030. Increasing adoption of wireless network infrastructure and rising adoption of smartphones, tablets, and other consumer electronics products are among the critical factors attributed to drive the Asia Pacific RF front-end chip market growth.

According to GSMA's annual State of Mobile Internet Connectivity Report 2023 (SOMIC), in October 2023, over half (54%) of the global population-approximately 4.3 billion people-owned a smartphone. The number of smartphones is increasing significantly. For example, according to Ericsson & The Radicati Group, in 2020, there were 5.75 billion smartphones, and in 2024, the number of smartphones grown to 6.93 billion, and as of 2025, it is expected to reach 7.15 billion. Also, tablets have become increasingly popular in recent years due to the range of benefits they offer over traditional laptops and desktop computers. The rising popularity of connected devices, such as tablets, smartphones, headphones, and wearables, further fuels the demand for RF frond-end chips. Smartphones and tablets often support numerous wireless services, including FM radio and LTE, across many frequency bands. At the same time, a growing number of smartphone and tablets use several antennas to improve sensitivity and reduce crosstalk. Miniature RF solid-state switches play a vital part in RF front-end designs for smart mobile devices. Consumers expect seamless connectivity and high data speeds, pushing manufacturers to incorporate advanced RF technologies into their devices. Hence, various market players have launched RF frond-end solutions for smartphones. For example, in May 2020, NXP Semiconductors NV announced that its most recent radio frequency front-end (RFFE) solution, designed with Wi-Fi 6 standards, was integrated into the Xiaomi Mi 10 5G smartphone. Thus, the growing adoption of smartphones, tablets, and other consumer electronics is driving the RF front-end chip market.

On the contrary, the high manufacturing cost of RF front-end chips hampers the growth of the Asia Pacific RF front-end chip market.

Based on component, the Asia Pacific RF front-end chip market is segmented into power amplifier, radio frequency filter, low noise amplifier, RF switch, and others. The power amplifier segment held 32.0% market share in 2022, amassing US$ 2,413.13 million. It is projected to garner US$ 7,504.10 million by 2030 to register 15.2% CAGR during 2022-2030.

Based on application, the Asia Pacific RF front-end chip market is segmented into consumer electronics, wireless communication, and others. The consumer electronics segment held 52.1% market share in 2022, amassing US$ 3,932.70 million. It is projected to garner US$ 11,098.11 million by 2030 to register 13.8% CAGR during 2022-2030.

Based on country, the Asia Pacific RF front-end chip market is categorized into China, Japan, India, South Korea, Australia, and the Rest of Asia Pacific. Our regional analysis states that China captured 34.7% share of Asia Pacific RF front-end chip market in 2022. It was assessed at US$ 2,619.94 million in 2022 and is likely to hit US$ 8,217.53 million by 2030, registering a CAGR of 15.4% during 2022-2030.

Key players operating in the Asia Pacific RF front-end chip market are Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, and Texas Instruments Inc, among others.

  • In January 2023, Skyworks Solutions launched 5G massive IoT SiP, Small Cell Front End. NXP Semiconductors NV announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems. The new SAF85xx one-chip family combines NXP's high performance radar sensing and processing technologies into a single device, offering tier ones and OEMs new flexibility in addressing short, medium and long-range radar applications to serve ever more challenging NCAP safety requirements.


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