2028년까지 아시아 태평양 재분배층 재료 시장 예측 – 재료 유형[폴리이미드(PI), 폴리벤조옥사졸(PBO), 벤조사이클로부텐(BCB) 및 기타] 및 애플리케이션별[팬아웃 웨이퍼 레벨 패키징(FOWLP)]에 따른 코로나19 영향 및 지역 분석 ) 및 2.5D/3D IC 패키징]

아시아 태평양 지역 재배선층 소재 시장은 2021년 1억 3,221만 달러에서 2028년 2억 5,070만 달러로 성장할 것으로 예상됩니다. 2021년부터 2028년까지 CAGR 9.6%로 성장할 것으로 예상됩니다.\\n\\n반도체 산업은 항상 비용 절감을 추구하는 혁신적인 솔루션 개발에 참여해 왔습니다. 현재 주요 반도체 업체들이 고려하고 있는 접근 방식 중 하나는 웨이퍼 및 스트립 크기에서 IC 조립 전용 대형 패널로 전환하는 것입니다. 효율성과 규모의 경제는 이 경로의 부가 가치입니다. 칩 제조업체, R&D 조직 및 OSAT는 다양한 애플리케이션을 위한 차세대 팬아웃 패키지를 개발하고 있습니다. 삼성전기(SEMCO)는 지난 2년간 4억 달러 이상을 투자해 신제품인 갤럭시 워치(Galaxy Watch)에 통합 APE를 탑재한 생산을 드디어 시작했다. SEMCO는 이러한 전략적 기술 선택을 통해 FOPLP 기술 개발을 위한 공격적인 로드맵을 통해 고밀도 팬아웃 패키징 분야에서 TSMC의 리더십을 목표로 삼고 있습니다. 삼성은 자체 패키징 솔루션을 기반으로 자체 프로세서를 생산하고 있습니다. 이 전략을 통해 회사는 금형부터 최종 제품까지 전체 공급망을 제어할 수 있습니다. 그러나 Apple과 같은 경쟁업체는 프로세서 제조를 주요 파트너에게 아웃소싱합니다. 2년 전, Apple은 TSMC가 출시한 FOWLP 기반 기술, 즉 inFo를 사용하기로 결정했습니다. 팬아웃 웨이퍼 레벨 인터포저 PoP(패키지 온 패키지)는 칩-웨이퍼 본딩 기술이 적용된 또 다른 새로운 RDL입니다. 새로운 기술은 짧은 신호 경로, 낮은 전력 소비, 다기능을 위한 이기종 통합, 소형 폼 팩터 등 모바일 애플리케이션에 많은 이점을 제공합니다. 또한 팬아웃 웨이퍼 레벨 인터포저 PoP는 PoP, 칩스케일패키지(CSP), 시스템인패키지(SiP) 등 다양한 패키지 플랫폼에 적용될 수 있다. IRDL(Inline Redistribution Layer) 기술은 절연층과 알루미늄을 추가로 금속층을 활용해 배선을 형성하는 첨단 FAB 기술입니다. 이 기술을 통해 사용자는 칩 간 접합을 더 얇고 간단하게 생산할 수 있습니다. 웨어러블 디바이스와 휴대폰의 지속적인 성장과 함께 모바일 메모리 수요도 꾸준히 개선되고 있습니다. 휴대폰의 경우 휴대성이 요구되기 때문에 저전력, 초박형 패키지 기술이 요구되고 있습니다. 따라서 IRDL은 이러한 요구 사항을 충족시키기 위해 반도체 산업에서 중요한 요소가 될 것으로 예상됩니다. 고성능·초소형 반도체에 대한 수요 증가로 인해 패키징 기술은 차세대 반도체의 핵심기술로 꾸준히 떠오르고 있습니다. 차세대 패키징 기술 개발은 반도체 성능과 생산 효율성 향상에 도움이 될 것입니다. \\n\\n아시아 태평양은 주요 국가의 존재, 거대한 산업 존재 및 산업 성장을 촉진하기 위한 우호적인 정부 정책으로 인해 재분배 층 재료 시장의 성장에 중요한 지역 중 하나입니다. 아시아 태평양 개발도상국의 높은 도시화와 산업 제조에 대한 투자 증가는 향후 시장 참가자들에게 수익성 있는 성장 기회를 제공할 것으로 예상됩니다. 그러나 코로나19 팬데믹으로 인해 아시아 태평양 지역의 다양한 산업 부문의 성장이 중단되었습니다. 주요 국가의 다양한 공장/공장의 폐쇄 또는 생산 능력 감소로 인해 글로벌 수급 균형이 제한되고 있으며, 이는 해당 지역의 제조, 납품 일정 및 다양한 제품 수요에 부정적인 영향을 미치고 있습니다. 2020년에는 아시아 태평양 국가의 다양한 정부 제한으로 인한 원자재 및 노동력 부족으로 인해 산업 활동, 신규 프로젝트, 연구 개발 투자 및 납품 일정이 감소했습니다. 대부분의 RDL 회사는 중국, 대만, 한국 및 일본에 제조 공장을 두고 있습니다. 따라서 언급된 국가 경제에 대한 발병의 부정적인 영향은 이들 회사의 수익에 직접적인 영향을 미쳤습니다. 이러한 모든 요인은 아시아 태평양 지역 재분배 레이어 재료 시장의 성장에 부정적인 영향을 미쳤습니다.\\n\\n아시아 태평양 재분배 레이어 재료 시장 수익 및 2028년 예측(미화 백만 달러)\\n\\n아시아 태평양 재분배 레이어 재료 시장 세분화 \\n\\n재료 유형별 아시아 태평양 재분배층 재료 시장\\n- 폴리이미드(PI)\\n- 폴리벤조옥사졸(PBO)\\n- 벤조사이클로부텐(BCB)\\n- 기타\\no 알루미늄 \\no 감광성 유전체\\no 페놀 및 기타\\ n\\n애플리케이션별 아시아 태평양 재분배 레이어 재료 시장\\n- FOWLP(팬아웃 웨이퍼 레벨 패키징)\\n- 2.5D/3D IC 패키징\\n국가별 아시아 태평양 재분배 레이어 재료 시장\\n- 한국\\n- 중국\\ n- 대만\\n- 일본\\n- 아시아 태평양 지역\\n아시아 태평양 재배포층 재료 시장-언급된 회사 \\n- Amkor Technology\\n- ASE 그룹\\n- Fujifilm Corporation\\n- Hitachi Chemical DuPont MicroSystems LLC\\n- INFINEON TECHNOLOGIES AG\\n- Jiangsu Changjiang Electronics Technology Co., Ltd.\\n- NXP Semiconductors\\n- Samsung Electronics Co., Ltd.\\n- Shin-Etsu Chemical Co., Ltd.\\n- SK Hynix Inc.\\ n\\n

Table of Content

1. Introduction

1.1 The Insight Partners Research Report Guidance

1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights

2.2 Market Attractiveness

2.2.1 Market Attractiveness

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. Asia Pacific Redistribution Layer Material Market Landscape

4.1 Overview

4.2 Porter's Five Forces Analysis

4.2.1 Bargaining Power of Suppliers

4.2.2 Bargaining Power of Buyers

4.2.3 Threat of New Entrants

4.2.4 Intensity of Competitive Rivalry

4.2.5 Threat of Substitutes

4.3 Ecosystem Analysis

4.3.1 Raw Material Suppliers

4.3.2 Manufacturers

4.3.3 End Use

4.3.4 List of Vendors in the Value Chain

4.3.4.1 List of Raw Material Suppliers in Value Chain

4.3.4.2 List of Manufacturers in Value Chain

5. Asia Pacific Redistribution Layer Material Market - Key Market Dynamics

5.1 Market Drivers

5.1.1 Growing Focus on AI-based Equipment and Tools

5.1.2 Increasing Demand from Automotive and Telecommunication Industries

5.2 Market Restraints

5.2.1 Fluctuation in Raw Material Prices

5.3 Market Opportunities

5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals

5.4 Future Trends

5.4.1 Advancements in the Packaging Technology

5.5 Impact Analysis

6. Redistribution Layer Material Market - Asia Pacific Market Analysis

6.1 Asia Pacific Redistribution Layer Material Market Volume (Tons)

6.2 Asia Pacific Redistribution Layer Material Market Revenue (US$ Million)

6.3 Asia Pacific Redistribution Layer Material Market Forecast and Analysis

7. Asia Pacific Redistribution Layer Material Market Analysis - Type

7.1 Polyimide (PI)

7.1.1 Overview

7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)

7.2 Polybenzoxazole (PBO)

7.2.1 Overview

7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)

7.3 Benzocylobutene (BCB)

7.3.1 Overview

7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)

7.4 Others

7.4.1 Overview

7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific Redistribution Layer Material Market Analysis - Application

8.1 Fan-Out Wafer Level Packaging (FOWLP)

8.1.1 Overview

8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)

8.2 2 5D/3D IC Packaging

8.2.1 Overview

8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)

8.2.3 High Bandwidth Memory (HBM)

8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)

8.2.4 Multi-Chip Integration

8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)

8.2.5 Package on Package (FOPOP)

8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)

8.2.6 Others

8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific Redistribution Layer Material Market - Country Analysis

9.1 Overview

9.1.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries

9.1.1.1 Redistribution Layer Material Market Breakdown by Country

9.1.1.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.3.1 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.2 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.3 China Redistribution Layer Material Market Breakdown by Application

9.1.1.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application

9.1.1.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.7.1 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.2 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.3 Japan Redistribution Layer Material Market Breakdown by Application

9.1.1.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.9.1 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.2 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.3 South Korea Redistribution Layer Material Market Breakdown by Application

9.1.1.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

11.1 Heat Map Analysis by Key Players

11.2 Company Positioning & Concentration

11. Industry Landscape

12.1 Overview

12.2 Market Initiative

12.3 New Product Development

12.4 Merger and Acquisition

12. Company Profiles

12.1 SK Hynix Inc

13.1.1 Key Facts

13.1.2 Business Description

13.1.3 Products and Services

13.1.4 Financial Overview

13.1.5 SWOT Analysis

13.1.6 Key Developments

12.2 Samsung Electronics Co Ltd

13.2.1 Key Facts

13.2.2 Business Description

13.2.3 Products and Services

13.2.4 Financial Overview

13.2.5 SWOT Analysis

13.2.6 Key Developments

12.3 Infineon Technologies AG

13.3.1 Key Facts

13.3.2 Business Description

13.3.3 Products and Services

13.3.4 Financial Overview

13.3.5 SWOT Analysis

13.3.6 Key Developments

12.4 DuPont de Nemours Inc

13.4.1 Key Facts

13.4.2 Business Description

13.4.3 Products and Services

13.4.4 Financial Overview

13.4.5 SWOT Analysis

13.4.6 Key Developments

12.5 FUJIFILM Holdings Corp

13.5.1 Key Facts

13.5.2 Business Description

13.5.3 Products and Services

13.5.4 Financial Overview

13.5.5 SWOT Analysis

13.5.6 Key Developments

12.6 Amkor Technology Inc

13.6.1 Key Facts

13.6.2 Business Description

13.6.3 Products and Services

13.6.4 Financial Overview

13.6.5 SWOT Analysis

13.6.6 Key Developments

12.7 ASE Technology Holding Co Ltd

13.7.1 Key Facts

13.7.2 Business Description

13.7.3 Products and Services

13.7.4 Financial Overview

13.7.5 SWOT Analysis

13.7.6 Key Developments

12.8 NXP Semiconductors NV

13.8.1 Key Facts

13.8.2 Business Description

13.8.3 Products and Services

13.8.4 Financial Overview

13.8.5 SWOT Analysis

13.8.6 Key Developments

12.9 JCET Group Co Ltd

13.9.1 Key Facts

13.9.2 Business Description

13.9.3 Products and Services

13.9.4 Financial Overview

13.9.5 SWOT Analysis

13.9.6 Key Developments

12.10 Shin-Etsu Chemical Co Ltd

13.10.1 Key Facts

13.10.2 Business Description

13.10.3 Products and Services

13.10.4 Financial Overview

13.10.5 SWOT Analysis

13.10.6 Key Developments

13. Appendix

List of Tables

Table 1. Asia Pacific Redistribution Layer Material Market Segmentation

Table 2. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Table 3. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Table 4. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type

Table 5. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type

Table 6. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application

Table 7. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 8. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 9. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 10. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 11. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 12. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 13. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 14. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 15. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 16. South Korea Redistribution Layer Material Market Revenue and Forecasts To 2030 (Kilo Ton) - By Type

Table 17. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 18. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 19. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 20. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 21. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 22. Company Positioning & Concentration

List of Figures

Figure 1. Asia Pacific Redistribution Layer Material Market Segmentation, By Country

Figure 2. Porter's Five Forces Analysis

Figure 3. Ecosystem: Asia Pacific Redistribution Layer Material Market

Figure 4. Market Dynamics: Asia Pacific Redistribution Layer Material Market

Figure 5. Asia Pacific Redistribution Layer Material Market Impact Analysis of Drivers and Restraints

Figure 6. Asia Pacific Redistribution Layer Material Market Volume (Tons), 2020 - 2030

Figure 7. Asia Pacific Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030

Figure 8. Asia Pacific Redistribution Layer Material Market Share (%) - Type, 2022 and 2030

Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)

Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)

Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)

Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 15. Others Market Volume and Forecasts To 2030 (Tons)

Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 17. Asia Pacific Redistribution Layer Material Market Share (%) - Application, 2022 and 2030

Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)

Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)

Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 24. Asia Pacific Redistribution Layer Material Market Breakdown by Key Countries, (2022) (US$ Million)

Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)

Figure 26. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 27. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 28. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 29. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 30. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 31. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 32. South Korea Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 33. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 34. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 35. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 36. Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 37. Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 38. Redistribution Layer Material Market Breakdown by Type (2022 and 2030)

Figure 39. Heat Map Analysis by Key Players

1. SK Hynix Inc

2. Samsung Electronics Co Ltd

3. Infineon Technologies AG

4. DuPont de Nemours Inc

5. FUJIFILM Holdings Corp

6. Amkor Technology Inc

7. ASE Technology Holding Co Ltd

8. NXP Semiconductors NV

9. JCET Group Co Ltd

10. Shin-Etsu Chemical Co Ltd

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the Asia Pacific redistribution layer material market.
Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in Asia Pacific redistribution layer material market, thereby allowing players across the value chain to develop effective long-term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth Asia Pacific market trends and outlook coupled with the factors driving the redistribution layer material market, as well as those hindering it.
Enhance the decision-making process by understanding the strategies that underpin security interest with respect to client products, segmentation, pricing, and distribution.

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Sample PDF showcases the content structure and the nature of the information included in the report which presents a qualitative and quantitative analysis.

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