Pronóstico del mercado de materiales de capa de redistribución de América del Norte hasta 2028: impacto de COVID-19 y análisis regional por tipo de material [poliimida (PI), polibenzoxazol (PBO), benzocilobuteno (BCB) y otros] y aplicación [empaquetado a nivel de oblea en abanico (FOWLP) ) y embalaje IC 2,5D/3D]

Se espera que el mercado de materiales de capas de redistribución en América del Norte crezca de 17,19 millones de dólares en 2021 a 34,06 millones de dólares en 2028; se estima que crecerá a una tasa compuesta anual del 10,3 % entre 2021 y 2028.\\n\\nLa industria de la electrónica de consumo está evolucionando a un ritmo exponencial. La presión de las demandas por parte del consumidor ha obligado a los proveedores a ofrecer productos distinguidos y ser los primeros en actuar en el mercado. La dura competencia con sus pares en la industria de la electrónica de consumo ha resultado en guerras de precios que han llevado a una disminución de la rentabilidad para los fabricantes. Como resultado de estos factores, los fabricantes se esfuerzan continuamente por innovar en su oferta de productos. A menudo los fabricantes han sentido curiosidad por convertirse en pioneros de nuevos productos en el mercado. La conversión de analógico a digital generó muchos estándares nuevos en audio y video, que mejoraron la calidad y la asequibilidad de la experiencia multimedia digital. Además, con el auge de la banda ancha, el acceso a los medios se ha vuelto fácil y gratificante para los consumidores. La proliferación de productos inteligentes está impulsando la necesidad de que los ingenieros mejoren el diseño de productos electrónicos y se concentren en ofrecer menores costos, menor energía y mayor rendimiento mediante la integración de funciones discretas. Los productos inteligentes actuales contienen sistemas electrónicos complejos que requieren un funcionamiento impecable en el mundo real. La miniaturización de dispositivos, la compatibilidad con múltiples tecnologías inalámbricas, velocidades de datos más rápidas y una mayor duración de la batería exigen un análisis riguroso. Además, la demanda de numerosas integraciones de funciones en un solo dispositivo ha llevado a diseños complejos de placas de circuitos electrónicos. Por ejemplo, un teléfono inteligente incluye cámara, función de llamada, linterna, unidades de almacenamiento, conectividad con otros dispositivos, puertos compatibles para conexiones, reproductor multimedia y muchas otras funciones. De manera similar, otros dispositivos electrónicos de consumo han ido mejorando en líneas similares, alentando a los fabricantes de semiconductores a miniaturizar aún más los chips e integrar más funcionalidades. La tendencia a la miniaturización en la industria de la electrónica de consumo ha impulsado la demanda de tamaños de componentes de paquetes hasta el nivel de las reglas de diseño de las tecnologías. La tecnología del paquete de circuito integrado (IC) debe ofrecer un mayor número de cables, un paso de cables reducido, un área de huella mínima y una reducción significativa del volumen. Por lo tanto, las continuas complejidades de diseño en el sector de la electrónica de consumo, junto con la miniaturización de estos dispositivos, impulsarían la demanda de material de capa de redistribución en toda América del Norte. \\n\\nLa pandemia de COVID-19 tuvo un impacto adverso en el crecimiento económico de América del Norte. Estados Unidos es el país más afectado del mundo debido al brote de COVID-19. Como resultado, hay una disminución en la adquisición de nuevos dispositivos debido al cierre temporal de negocios y a interrupciones en la cadena de suministro y las actividades de fabricación. Los factores han impactado los ingresos y el crecimiento del mercado de material de capa de redistribución de América del Norte. Las pequeñas y medianas empresas/nuevas empresas en el mercado fueron testigos de un severo impacto de la pandemia. Sin embargo, los esfuerzos de reestructuración en curso realizados por las empresas semipersonalizadas para abordar los problemas de la cadena de suministro y aumentar la coordinación con socios de ventas y proveedores puede ayudar a reducir el impacto negativo de la pandemia.\\n\\nIngresos y pronóstico del mercado de materiales de capa de redistribución de América del Norte hasta 2028 (millones de dólares estadounidenses)\\n\\nSegmentación del mercado de materiales de capa de redistribución de América del Norte\\n \\nMercado de materiales de capa de redistribución de América del Norte por tipo de material\\n- Poliimida (PI)\\n- Polibenzoxazol (PBO)\\n- Benzocilobuteno (BCB)\\n- Otros\\no Aluminio \\no Dieléctricos fotosensibles\\no Fenoles y otros\\n\\ nMercado de material de capa de redistribución de América del Norte por aplicación\\n- Empaquetado a nivel de oblea en abanico (FOWLP)\\n- Embalaje de circuitos integrados 2,5D/3D\\nMercado de material de capa de redistribución de América del Norte por país\\n- EE. UU.\\n- Canadá \\n- México \\nMercado de materiales de capas de redistribución de América del Norte: empresas mencionadas \\n- Amkor Technology\\n- ASE Group\\n- Fujifilm Corporation\\n- Hitachi Chemical DuPont MicroSystems LLC\\n- INFINEON TECHNOLOGIES AG\\n- Jiangsu Changjiang Electronics Technology Co., Ltd .\\n- NXP Semiconductors\\n- Samsung Electronics Co., Ltd.\\n- Shin-Etsu Chemical Co., Ltd.\\n- SK Hynix Inc.\\n\\n

Table of Content

1. Introduction

1.1 The Insight Partners Research Report Guidance

1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights

2.2 Market Attractiveness

2.2.1 Market Attractiveness

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. North America Redistribution Layer Material Market Landscape

4.1 Overview

4.2 Porter's Five Forces Analysis

4.2.1 Bargaining Power of Suppliers

4.2.2 Bargaining Power of Buyers

4.2.3 Threat of New Entrants

4.2.4 Intensity of Competitive Rivalry

4.2.5 Threat of Substitutes

4.3 Ecosystem Analysis

4.3.1 Raw Material Suppliers

4.3.2 Manufacturers

4.3.3 End Use

5. North America Redistribution Layer Material Market - Key Market Dynamics

5.1 Market Drivers

5.1.1 Growing Focus on AI-based Equipment and Tools

5.1.2 Increasing Demand from Automotive and Telecommunication Industries

5.2 Market Restraints

5.2.1 Fluctuation in Raw Material Prices

5.3 Market Opportunities

5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals

5.4 Future Trends

5.4.1 Advancements in the Packaging Technology

5.5 Impact Analysis

6. Redistribution Layer Material Market - North America Market Analysis

6.1 North America Redistribution Layer Material Market Volume (Tons)

6.2 North America Redistribution Layer Material Market Revenue (US$ Million)

6.3 North America Redistribution Layer Material Market Forecast and Analysis

7. North America Redistribution Layer Material Market Analysis - Type

7.1 Polyimide (PI)

7.1.1 Overview

7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)

7.2 Polybenzoxazole (PBO)

7.2.1 Overview

7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)

7.3 Benzocylobutene (BCB)

7.3.1 Overview

7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)

7.4 Others

7.4.1 Overview

7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. North America Redistribution Layer Material Market Analysis - Application

8.1 Fan-Out Wafer Level Packaging (FOWLP)

8.1.1 Overview

8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)

8.2 2 5D/3D IC Packaging

8.2.1 Overview

8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)

8.2.3 High Bandwidth Memory (HBM)

8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)

8.2.4 Multi-Chip Integration

8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)

8.2.5 Package on Package (FOPOP)

8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)

8.2.6 Others

8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. North America Redistribution Layer Material Market - Country Analysis

9.1 Overview

9.1.1 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries

9.1.1.1 North America Redistribution Layer Material Market Breakdown by Country

9.1.1.2 US: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.3 US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.3.1 US: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.3.2 US: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.3.3 US: North America Redistribution Layer Material Market Breakdown by Application

9.1.1.4 Canada: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.5 Canada North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.5.1 Canada: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.5.2 Canada: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.5.3 Canada: North America Redistribution Layer Material Market Breakdown by Application

9.1.1.6 Mexico: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.7 Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.7.1 Mexico: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.7.2 Mexico: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.7.3 Mexico: North America Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

10.1 Heat Map Analysis by Key Players

10.2 Company Positioning & Concentration

11. Industry Landscape

11.1 Overview

11.2 Market Initiative

11.3 New Product Development

11.4 Merger and Acquisition

12. Company Profiles

12.1 SK Hynix Inc

12.1.1 Key Facts

12.1.2 Business Description

12.1.3 Products and Services

12.1.4 Financial Overview

12.1.5 SWOT Analysis

12.1.6 Key Developments

12.2 Samsung Electronics Co Ltd

12.2.1 Key Facts

12.2.2 Business Description

12.2.3 Products and Services

12.2.4 Financial Overview

12.2.5 SWOT Analysis

12.2.6 Key Developments

12.3 Infineon Technologies AG

12.3.1 Key Facts

12.3.2 Business Description

12.3.3 Products and Services

12.3.4 Financial Overview

12.3.5 SWOT Analysis

12.3.6 Key Developments

12.4 DuPont de Nemours Inc

12.4.1 Key Facts

12.4.2 Business Description

12.4.3 Products and Services

12.4.4 Financial Overview

12.4.5 SWOT Analysis

12.4.6 Key Developments

12.5 FUJIFILM Holdings Corp

12.5.1 Key Facts

12.5.2 Business Description

12.5.3 Products and Services

12.5.4 Financial Overview

12.5.5 SWOT Analysis

12.5.6 Key Developments

12.6 Amkor Technology Inc

12.6.1 Key Facts

12.6.2 Business Description

12.6.3 Products and Services

12.6.4 Financial Overview

12.6.5 SWOT Analysis

12.6.6 Key Developments

12.7 ASE Technology Holding Co Ltd

12.7.1 Key Facts

12.7.2 Business Description

12.7.3 Products and Services

12.7.4 Financial Overview

12.7.5 SWOT Analysis

12.7.6 Key Developments

12.8 NXP Semiconductors NV

12.8.1 Key Facts

12.8.2 Business Description

12.8.3 Products and Services

12.8.4 Financial Overview

12.8.5 SWOT Analysis

12.8.6 Key Developments

12.9 JCET Group Co Ltd

12.9.1 Key Facts

12.9.2 Business Description

12.9.3 Products and Services

12.9.4 Financial Overview

12.9.5 SWOT Analysis

12.9.6 Key Developments

12.10 Shin-Etsu Chemical Co Ltd

12.10.1 Key Facts

12.10.2 Business Description

12.10.3 Products and Services

12.10.4 Financial Overview

12.10.5 SWOT Analysis

12.10.6 Key Developments

13. Appendix

List of Tables

Table 1. North America Redistribution Layer Material Market Segmentation

Table 2. North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Table 3. North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Table 4. North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type

Table 5. North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type

Table 6. North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application

Table 7. US: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 8. US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 9. US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 10. Canada: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 11. Canada: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 12. Canada: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 13. Mexico: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 14. Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 15. Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 16. Company Positioning & Concentration

List of Figures

Figure 1. North America Redistribution Layer Material Market Segmentation, By Country

Figure 2. Porter's Five Forces Analysis

Figure 3. Ecosystem: North America Redistribution Layer Material Market

Figure 4. Market Dynamics: North America Redistribution Layer Material Market

Figure 5. North America Redistribution Layer Material Market Impact Analysis of Drivers and Restraints

Figure 6. North America Redistribution Layer Material Market Volume (Tons), 2020 - 2030

Figure 7. North America Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030

Figure 8. North America Redistribution Layer Material Market Share (%) - Type, 2022 and 2030

Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)

Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)

Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)

Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 15. Others Market Volume and Forecasts To 2030 (Tons)

Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 17. North America Redistribution Layer Material Market Share (%) - Application, 2022 and 2030

Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)

Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)

Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 24. North America Redistribution Layer Material Market by Key Countries - Revenue (2022) (US$ Million)

Figure 25. North America Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)

Figure 26. US: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 27. US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 28. Canada: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 29. Canada North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 30. Mexico: North America Redistribution Layer Material Market Revenue and Forecasts To 2030 (Tons)

Figure 31. Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 32. Heat Map Analysis by Key Players

1. SK Hynix Inc

2. Samsung Electronics Co Ltd

3. Infineon Technologies AG

4. DuPont de Nemours Inc

5. FUJIFILM Holdings Corp

6. Amkor Technology Inc

7. ASE Technology Holding Co Ltd

8. NXP Semiconductors NV

9. JCET Group Co Ltd

10. Shin-Etsu Chemical Co Ltd

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the North America redistribution layer material market.
Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in North America redistribution layer material market, thereby allowing players across the value chain to develop effective long-term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth North America market trends and outlook coupled with the factors driving the redistribution layer material market, as well as those hindering it.
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