Pronóstico del mercado de chips frontales de RF de Asia Pacífico hasta 2030: análisis regional, por componente (amplificador de potencia, filtro de radiofrecuencia, amplificador de bajo ruido, conmutador de RF y otros) y aplicación (electrónica de consumo, comunicación inalámbrica y otros)

BMIRE00030856 | Pages: 143 | Electronics and Semiconductor | Oct 2024 | Type: Regional | Status: Published

El mercado de chips front-end de RF de Asia Pacífico se valoró en 7.548,09 millones de dólares en 2022 y se espera que alcance los 21.117,24 millones de dólares en 2030; se estima que registrará una CAGR del 13,7% entre 2022 y 2030.

La aparición de la tecnología 5G impulsa el mercado de chips front-end de RF de Asia Pacífico

La tecnología 5G ofrece velocidades significativamente más rápidas en comparación con las generaciones anteriores de redes móviles. Debido a esto, la adopción de la tecnología 5G está aumentando. Según la Asociación Global de Proveedores Móviles (GSA), había 1.150 millones de suscriptores de 5G a fines de 2022. Además, la entrada múltiple masiva, salida múltiple (M-MIMO) está lista para ser la arquitectura elegida para las radios de red 5G nacientes, ya que las cualidades requeridas de eficiencia espectral y confiabilidad de transmisión son inherentes a esta arquitectura. La aparición de 5G plantea varios desafíos. Los diseñadores de 5G deben aumentar masivamente la cantidad de canales transceptores instantáneos que operan en múltiples bandas mientras comprimen todo el hardware necesario en un factor de forma que sea tan grande o más pequeño que el equipo de la generación 4G anterior. El crecimiento de la tecnología 5G requiere un alto ancho de banda de RF y, por lo tanto, un aumento en la cantidad de componentes como filtros acústicos, conmutadores de RF y amplificadores de potencia integrados en unos pocos chips frontales de RF. Con la aparición de 5G, hay un crecimiento en la cantidad de receptores y transmisores de radio RF que crean una oportunidad de crecimiento masiva para el crecimiento del mercado de chips frontales de RF.

Descripción general del mercado de chips frontales de RF de Asia Pacífico

El mercado de chips frontales de RF de Asia Pacífico está segmentado en Alemania, Francia, Italia, el Reino Unido, Rusia y el resto de Asia Pacífico. El mercado de chips frontales de RF de Asia Pacífico se está expandiendo rápidamente debido a la innovación técnica, una base industrial sólida y la creciente demanda de soluciones de comunicación avanzadas. La implementación de la tecnología 5G, los avances en la automatización industrial y la expansión de las redes de comunicación inalámbrica tienen un impacto positivo en la dinámica del mercado en Asia Pacífico. El creciente despliegue de la tecnología 5G ha animado a diversos actores de Asia Pacífico a participar en actividades de fusiones y adquisiciones para satisfacer la demanda de chips frontales de RF. Por ejemplo, en octubre de 2020, STMicroelectronics adquirió Somos Semiconductor, una empresa francesa de semiconductores sin fábrica centrada en amplificadores de potencia basados en silicio y módulos frontales de RF (FEM) para las industrias de IoT celular y 5G. Se prevé que la adquisición de Somos Semiconductor mejore su IP FEM y su hoja de ruta de productos para las industrias de IoT y 5G, además de reforzar su personal especializado. Un producto inicial, un módulo NB-IoT/CAT-M1, está pasando ahora por el proceso de calificación estándar y es el comienzo de una nueva hoja de ruta de productos FEM de conectividad RF.

Asia Pacífico también alberga varias soluciones tecnológicamente avanzadas, como IoT, y los países de Asia Pacífico tienen industrias de semiconductores prósperas. Según Eurostat, en 2021, el 29 % de las empresas de la UE utilizaron dispositivos IoT, principalmente para mantener la seguridad de sus instalaciones. Esto fomenta la innovación en tecnologías de chips frontales de RF, lo que da como resultado la creación de componentes confiables y de alto rendimiento. Varios actores en Asia Pacífico están proporcionando chips frontales de RF para dispositivos IoT. Por ejemplo, Skyworks Solutions Inc. proporciona módulos frontales de RF (FEM) de IoT de Skyworks Solutions Inc. que admiten numerosos protocolos inalámbricos y SoC/RFIC en un solo módulo RF. El FEM de IoT es adecuado para la conectividad inalámbrica, ya que admite los estándares ZigBee, Thread y Bluetooth, incluido BLUETOOTH 5. El FEM de IoT es una solución eficiente de Internet de las cosas (IoT) cuando se vincula con una plataforma de sistema en chip (SoC). Por lo tanto, todos los factores mencionados anteriormente impulsan el crecimiento del mercado de chips frontales de RF.

Ingresos y pronóstico del mercado de chips frontales de RF de Asia Pacífico hasta 2030 (millones de USD)

Segmentación del mercado de chips frontales de RF de Asia Pacífico

El mercado de chips frontales de RF de Asia Pacífico se clasifica en componente, aplicación y país.

Según el componente, el mercado de chips frontales de RF de Asia Pacífico se segmenta en amplificador de potencia, filtro de radiofrecuencia, amplificador de bajo ruido, conmutador de RF y otros. El segmento de amplificadores de potencia tuvo la mayor participación de mercado en 2022.

Según la aplicación, el mercado de chips frontales de RF de Asia Pacífico está segmentado en electrónica de consumo, comunicación inalámbrica y otros. El segmento de electrónica de consumo tuvo la mayor participación de mercado en 2022.

Por país, el mercado de chips frontales de RF de Asia Pacífico está segmentado en China, Japón, India, Corea del Sur, Australia y el resto de Asia Pacífico. China dominó la participación de mercado de chips front-end de RF en Asia Pacífico en 2022.

Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp y Texas Instruments Inc son algunas de las empresas líderes que operan en el mercado de chips front-end de RF en Asia Pacífico.

TABLE OF CONTENTS

 

1. Introduction

1.1 The Insight Partners Research Report Guidance

1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights

2.2 Market Attractiveness

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. Asia Pacific RF Front-End Chip Market Landscape

4.1 Overview

4.2 Ecosystem Analysis

4.2.1 List of Vendors in the Value Chain

5. Asia Pacific RF Front-End Chip Market - Key Market Dynamics

5.1 Market Drivers

5.1.1 Increasing Adoption of Wireless Network Infrastructure

5.1.2 Rising Adoption of Smartphones, Tablets, and Other Consumer Electronics Products

5.2 Market Restraints

5.2.1 High Manufacturing Cost of RF Front-End Chips

5.2.2 Integration Challenges Of RF Front-End Chips

5.3 Market Opportunities

5.3.1 Proliferation of Internet of Things (IoT) Devices

5.3.2 Emergence of 5G Technology

5.4 Future Trends

5.4.1 Miniaturization of RF Frond-End Modules

5.4.2 Multi-Chip Front-End Modules

5.5 Impact of Drivers and Restraints:

6. RF Front-End Chip Market - Asia Pacific Market Analysis

6.1 Asia Pacific RF Front-End Chip Market Revenue (US$ Million), 2022-2030

6.2 Asia Pacific RF Front-End Chip Market Forecast Analysis

7. Asia Pacific RF Front-End Chip Market Analysis - by Component

7.1 Power Amplifier

7.1.1 Overview

7.1.2 Power Amplifier: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

7.2 Radio Frequency Filter

7.2.1 Overview

7.2.2 Radio Frequency Filter: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

7.3 Low Noise Amplifier

7.3.1 Overview

7.3.2 Low Noise Amplifier: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

7.4 RF Switch

7.4.1 Overview

7.4.2 RF Switch: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

7.5 Others

7.5.1 Overview

7.5.2 Others: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific RF Front-End Chip Market Analysis - by Application

8.1 Consumer Electronics

8.1.1 Overview

8.1.2 Consumer Electronics: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

8.2 Wireless Communication

8.2.1 Overview

8.2.2 Wireless Communication: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

8.3 Others

8.3.1 Overview

8.3.2 Others: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific RF Front-End Chip Market - Country Analysis

9.1 Asia Pacific RF Front-End Chip Market

9.1.1 Asia Pacific RF Front-End Chip Market - Revenue and Forecast Analysis - by Country

9.1.1.1 Asia Pacific RF Front-End Chip Market - Revenue and Forecast Analysis - by Country

9.1.1.2 China: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

9.1.1.2.1 China: RF Front-End Chip Market Breakdown, by Component

9.1.1.2.2 China: RF Front-End Chip Market Breakdown, by Application

9.1.1.3 Japan: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

9.1.1.3.1 Japan: RF Front-End Chip Market Breakdown, by Component

9.1.1.3.2 Japan: RF Front-End Chip Market Breakdown, by Application

9.1.1.4 India: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

9.1.1.4.1 India: RF Front-End Chip Market Breakdown, by Component

9.1.1.4.2 India: RF Front-End Chip Market Breakdown, by Application

9.1.1.5 South Korea: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

9.1.1.5.1 South Korea: RF Front-End Chip Market Breakdown, by Component

9.1.1.5.2 South Korea: RF Front-End Chip Market Breakdown, by Application

9.1.1.6 Australia: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

9.1.1.6.1 Australia: RF Front-End Chip Market Breakdown, by Component

9.1.1.6.2 Australia: RF Front-End Chip Market Breakdown, by Application

9.1.1.7 Rest of APAC: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

9.1.1.7.1 Rest of APAC: RF Front-End Chip Market Breakdown, by Component

9.1.1.7.2 Rest of APAC: RF Front-End Chip Market Breakdown, by Application

10. Competitive Landscape

10.1 Company Positioning & Concentration

10.2 Heat Map Analysis by Key Players

11. Industry Landscape

11.1 Overview

11.2 Market Initiative

11.3 Product Development

11.4 Mergers & Acquisitions

12. Company Profiles

12.1 Infineon Technologies AG

12.1.1 Key Facts

12.1.2 Business Description

12.1.3 Products and Services

12.1.4 Financial Overview

12.1.5 SWOT Analysis

12.1.6 Key Developments

12.2 TDK Corp

12.2.1 Key Facts

12.2.2 Business Description

12.2.3 Products and Services

12.2.4 Financial Overview

12.2.5 SWOT Analysis

12.2.6 Key Developments

12.3 Texas Instruments Inc

12.3.1 Key Facts

12.3.2 Business Description

12.3.3 Products and Services

12.3.4 Financial Overview

12.3.5 SWOT Analysis

12.3.6 Key Developments

12.4 Broadcom Inc

12.4.1 Key Facts

12.4.2 Business Description

12.4.3 Products and Services

12.4.4 Financial Overview

12.4.5 SWOT Analysis

12.4.6 Key Developments

12.5 Qorvo Inc

12.5.1 Key Facts

12.5.2 Business Description

12.5.3 Products and Services

12.5.4 Financial Overview

12.5.5 SWOT Analysis

12.5.6 Key Developments

12.6 Skyworks Solutions Inc

12.6.1 Key Facts

12.6.2 Business Description

12.6.3 Products and Services

12.6.4 Financial Overview

12.6.5 SWOT Analysis

12.6.6 Key Developments

12.7 STMicroelectronics NV

12.7.1 Key Facts

12.7.2 Business Description

12.7.3 Products and Services

12.7.4 Financial Overview

12.7.5 SWOT Analysis

12.7.6 Key Developments

12.8 Murata Manufacturing Co Ltd

12.8.1 Key Facts

12.8.2 Business Description

12.8.3 Products and Services

12.8.4 Financial Overview

12.8.5 SWOT Analysis

12.8.6 Key Developments

12.9 Microchip Technology Inc

12.9.1 Key Facts

12.9.2 Business Description

12.9.3 Products and Services

12.9.4 Financial Overview

12.9.5 SWOT Analysis

12.9.6 Key Developments

12.10 NXP Semiconductors NV

12.10.1 Key Facts

12.10.2 Business Description

12.10.3 Products and Services

12.10.4 Financial Overview

12.10.5 SWOT Analysis

12.10.6 Key Developments

13. Appendix

13.1 Word Index

13.2 About The Insight Partners

 

LIST OF TABLES

Table 1. Asia Pacific RF Front-End Chip Market Segmentation

Table 2. List of Vendors

Table 3. Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Table 4. Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Component

Table 5. Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Application

Table 6. Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Country

Table 7. China: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Component

Table 8. China: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Application

Table 9. Japan: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Component

Table 10. Japan: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Application

Table 11. India: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Component

Table 12. India: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Application

Table 13. South Korea: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Component

Table 14. South Korea: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Application

Table 15. Australia: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Component

Table 16. Australia: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Application

Table 17. Rest of APAC: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Component

Table 18. Rest of APAC: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million) - by Application

Table 19. Company Positioning & Concentration

Table 20. List of Abbreviation

 

LIST OF FIGURES

Figure 1. Asia Pacific RF Front-End Chip Market Segmentation, by Country

Figure 2. Asia Pacific RF Front-End Chip Market - Key Market Dynamics

Figure 3. Impact Analysis of Drivers and Restraints

Figure 4. Asia Pacific RF Front-End Chip Market Revenue (US$ Million), 2022-2030

Figure 5. Asia Pacific RF Front-End Chip Market Share (%) - by Component (2022 and 2030)

Figure 6. Power Amplifier: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 7. Radio Frequency Filter: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 8. Low Noise Amplifier: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 9. RF Switch: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 10. Others: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 11. Asia Pacific RF Front-End Chip Market Share (%) - by Application (2022 and 2030)

Figure 12. Consumer Electronics: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 13. Wireless Communication: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 14. Others: Asia Pacific RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 15. Asia Pacific: RF Front-End Chip Market, By Key Country - Revenue (2022) (US$ Million)

Figure 16. Asia Pacific RF Front-End Chip Market Breakdown, by Key Countries, 2022 and 2030 (%)

Figure 17. China: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 18. Japan: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 19. India: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 20. South Korea: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 21. Australia: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 22. Rest of APAC: RF Front-End Chip Market - Revenue and Forecast to 2030 (US$ Million)

Figure 23. Heat Map Analysis by Key Players

 

?

  1. Broadcom Inc
  2. Infineon Technologies AG
  3. Microchip Technology Inc
  4. Murata Manufacturing Co Ltd
  5. NXP Semiconductors NV
  6. Qorvo Inc
  7. Skyworks Solutions Inc
  8. STMicroelectronics NV
  9. TDK Corp
  10. Texas Instruments Inc
  • Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the Asia Pacific RF front-end chip market.
  • Highlights key business priorities in order to assist companies to realign their business strategies.
  • The key findings and recommendations highlight crucial progressive industry trends in the Asia Pacific RF front-end chip market, thereby allowing players across the value chain to develop effective long-term strategies.
  • Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
  • Scrutinize in-depth Asia Pacific market trends and outlook coupled with the factors driving the Asia Pacific RF front-end chip market, as well as those hindering it.
  • Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing, and distribution.
Report Code
Full Name
Country Name
Email Id
Phone Number
Job Title
Company
Requirement

Note : Your data will never be shared with third parties, however, we may send you information from time to time about our products that may be of interest to you. By submitting your details, you agree to be contacted by us. You may contact us at any time to opt-out.


Purchase Options
Single User License
$3550
$2485
Site License
$4550
$3185
Enterprise License
$5550
$3885