Pronóstico del mercado de materiales de capa de redistribución de Asia Pacífico hasta 2028: impacto de COVID-19 y análisis regional por tipo de material [poliimida (PI), polibenzoxazol (PBO), benzocilobuteno (BCB) y otros] y aplicación [empaquetado a nivel de oblea en abanico (FOWLP) ) y embalaje IC 2,5D/3D]

Se espera que el mercado de materiales de capas de redistribución en Asia Pacífico crezca de 132,21 millones de dólares en 2021 a 250,70 millones de dólares en 2028; se estima que crecerá a una tasa compuesta anual del 9,6 % entre 2021 y 2028.\\n\\nLa industria de los semiconductores siempre ha estado involucrada en el desarrollo de soluciones innovadoras en la búsqueda de la reducción de costos. Un enfoque considerado actualmente por los principales actores de semiconductores es la migración del tamaño de oblea y tira a paneles de gran tamaño dedicados al ensamblaje de circuitos integrados. La eficiencia y las economías de escala son el valor añadido de este camino. Los fabricantes de chips, las organizaciones de I+D y los OSAT están desarrollando la próxima ola de paquetes de distribución para diversas aplicaciones. Samsung Electro Mechanics (SEMCO) ha invertido más de 400 millones de dólares durante los últimos dos años y finalmente ha comenzado la producción con APE integrado para su nuevo producto de consumo, el Galaxy Watch. Con esta elección técnica estratégica, SEMCO apunta al liderazgo de TSMC en empaques de alta densidad, con una hoja de ruta agresiva para el desarrollo de tecnología FOPLP. Samsung está fabricando sus propios procesadores basándose en soluciones de embalaje internas. Esta estrategia permite a la empresa controlar toda la cadena de suministro, desde la matriz hasta el producto final. Sin embargo, competidores como Apple subcontratan la fabricación de procesadores a socios clave. Hace dos años, Apple decidió utilizar una tecnología basada en FOWLP lanzada por TSMC, llamada inFo. El paquete sobre paquete (PoP) intercalador a nivel de oblea en abanico es otro nuevo RDL con tecnología de unión de chip a oblea. La nueva tecnología tiene muchas ventajas para aplicaciones móviles, como ruta de señal corta, bajo consumo de energía, integración heterogénea para multifunción y factor de forma pequeño. Además, el intercalador PoP de nivel de oblea de despliegue se puede aplicar en diferentes plataformas de paquetes, incluidos PoP, paquete de escala de chip (CSP) y sistema en paquete (SiP). La tecnología de capa de redistribución en línea (IRDL) es una tecnología FAB avanzada que forma el cableado utilizando capas metálicas adicionales con una capa aislante y aluminio. Esta tecnología permite al usuario producir uniones de chip a chip más delgadas y simples. La demanda de memoria móvil está mejorando constantemente, junto con el crecimiento constante de dispositivos portátiles y teléfonos móviles. Cuando se trata de teléfonos móviles, se requiere portabilidad, lo que está creando la necesidad de tecnología de paquete ultradelgado y de bajo consumo. Por lo tanto, se prevé que IRDL sea un elemento crucial en la industria de los semiconductores para satisfacer este requisito. Debido a la mayor demanda de semiconductores ultrapequeños y de alto rendimiento, la tecnología de embalaje emerge constantemente como una tecnología central para los semiconductores de próxima generación. El desarrollo de tecnología de envasado de próxima generación ayudará a mejorar el rendimiento de los semiconductores y la eficiencia de la producción. \\n\\nAsia Pacífico es una de las regiones cruciales para el crecimiento del mercado de materiales de capas de redistribución debido a la presencia de países clave, una enorme presencia industrial y políticas gubernamentales favorables para impulsar el crecimiento industrial. También se prevé que la alta urbanización en los países en desarrollo de Asia Pacífico y el aumento de las inversiones en la fabricación industrial ofrezcan lucrativas oportunidades de crecimiento a los actores del mercado en los próximos años. Sin embargo, la pandemia de COVID-19 provocó interrupciones en el crecimiento de varios sectores industriales en Asia Pacífico. El bloqueo o la capacidad reducida de varias plantas/fábricas en los principales países está restringiendo el equilibrio de la oferta y la demanda global, lo que está impactando negativamente la fabricación, los cronogramas de entrega y la demanda de diversos productos en la región. En 2020, las actividades industriales, los nuevos proyectos, las inversiones en investigación y desarrollo y los cronogramas de entrega experimentaron una disminución debido a la escasez de materias primas y mano de obra causada por varias restricciones gubernamentales en los países de Asia Pacífico. La mayoría de las empresas de RDL tienen sus plantas de fabricación en China, Taiwán, Corea del Sur y Japón. Por lo tanto, el impacto negativo del brote en la economía de los países mencionados ha impactado directamente en los ingresos de estas empresas. Todos estos factores han impactado negativamente el crecimiento del mercado de material de capa de redistribución en Asia Pacífico.\\n\\nIngresos del mercado de material de capa de redistribución de Asia Pacífico y pronóstico para 2028 (millones de dólares estadounidenses)\\n\\nSegmentación del mercado de material de capa de redistribución de Asia Pacífico \\n\\nMercado de materiales de capa de redistribución de Asia Pacífico por tipo de material\\n- Poliimida (PI)\\n- Polibenzoxazol (PBO)\\n- Benzocilobuteno (BCB)\\n- Otros\\no Aluminio \\no Dieléctricos fotosensibles\\no Fenoles y otros\\ n\\nMercado de material de capa de redistribución de Asia Pacífico por aplicación\\n- Empaquetado a nivel de oblea en abanico (FOWLP)\\n- Embalaje IC 2.5D/3D\\nMercado de material de capa de redistribución de Asia Pacífico por país\\n- Corea del Sur\\n- China\\ n- Taiwán\\n- Japón\\n- Resto de Asia Pacífico\\nMercado de materiales de capa de redistribución de Asia Pacífico: empresas mencionadas \\n- Amkor Technology\\n- ASE Group\\n- Fujifilm Corporation\\n- Hitachi Chemical DuPont MicroSystems LLC\\n- INFINEON TECHNOLOGIES AG\\n- Jiangsu Changjiang Electronics Technology Co., Ltd.\\n- NXP Semiconductors\\n- Samsung Electronics Co., Ltd.\\n- Shin-Etsu Chemical Co., Ltd.\\n- SK Hynix Inc.\\ n\\n

Table of Content

1. Introduction

1.1 The Insight Partners Research Report Guidance

1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights

2.2 Market Attractiveness

2.2.1 Market Attractiveness

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. Asia Pacific Redistribution Layer Material Market Landscape

4.1 Overview

4.2 Porter's Five Forces Analysis

4.2.1 Bargaining Power of Suppliers

4.2.2 Bargaining Power of Buyers

4.2.3 Threat of New Entrants

4.2.4 Intensity of Competitive Rivalry

4.2.5 Threat of Substitutes

4.3 Ecosystem Analysis

4.3.1 Raw Material Suppliers

4.3.2 Manufacturers

4.3.3 End Use

4.3.4 List of Vendors in the Value Chain

4.3.4.1 List of Raw Material Suppliers in Value Chain

4.3.4.2 List of Manufacturers in Value Chain

5. Asia Pacific Redistribution Layer Material Market - Key Market Dynamics

5.1 Market Drivers

5.1.1 Growing Focus on AI-based Equipment and Tools

5.1.2 Increasing Demand from Automotive and Telecommunication Industries

5.2 Market Restraints

5.2.1 Fluctuation in Raw Material Prices

5.3 Market Opportunities

5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals

5.4 Future Trends

5.4.1 Advancements in the Packaging Technology

5.5 Impact Analysis

6. Redistribution Layer Material Market - Asia Pacific Market Analysis

6.1 Asia Pacific Redistribution Layer Material Market Volume (Tons)

6.2 Asia Pacific Redistribution Layer Material Market Revenue (US$ Million)

6.3 Asia Pacific Redistribution Layer Material Market Forecast and Analysis

7. Asia Pacific Redistribution Layer Material Market Analysis - Type

7.1 Polyimide (PI)

7.1.1 Overview

7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)

7.2 Polybenzoxazole (PBO)

7.2.1 Overview

7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)

7.3 Benzocylobutene (BCB)

7.3.1 Overview

7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)

7.4 Others

7.4.1 Overview

7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific Redistribution Layer Material Market Analysis - Application

8.1 Fan-Out Wafer Level Packaging (FOWLP)

8.1.1 Overview

8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)

8.2 2 5D/3D IC Packaging

8.2.1 Overview

8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)

8.2.3 High Bandwidth Memory (HBM)

8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)

8.2.4 Multi-Chip Integration

8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)

8.2.5 Package on Package (FOPOP)

8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)

8.2.6 Others

8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific Redistribution Layer Material Market - Country Analysis

9.1 Overview

9.1.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries

9.1.1.1 Redistribution Layer Material Market Breakdown by Country

9.1.1.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.3.1 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.2 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.3 China Redistribution Layer Material Market Breakdown by Application

9.1.1.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application

9.1.1.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.7.1 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.2 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.3 Japan Redistribution Layer Material Market Breakdown by Application

9.1.1.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.9.1 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.2 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.3 South Korea Redistribution Layer Material Market Breakdown by Application

9.1.1.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

11.1 Heat Map Analysis by Key Players

11.2 Company Positioning & Concentration

11. Industry Landscape

12.1 Overview

12.2 Market Initiative

12.3 New Product Development

12.4 Merger and Acquisition

12. Company Profiles

12.1 SK Hynix Inc

13.1.1 Key Facts

13.1.2 Business Description

13.1.3 Products and Services

13.1.4 Financial Overview

13.1.5 SWOT Analysis

13.1.6 Key Developments

12.2 Samsung Electronics Co Ltd

13.2.1 Key Facts

13.2.2 Business Description

13.2.3 Products and Services

13.2.4 Financial Overview

13.2.5 SWOT Analysis

13.2.6 Key Developments

12.3 Infineon Technologies AG

13.3.1 Key Facts

13.3.2 Business Description

13.3.3 Products and Services

13.3.4 Financial Overview

13.3.5 SWOT Analysis

13.3.6 Key Developments

12.4 DuPont de Nemours Inc

13.4.1 Key Facts

13.4.2 Business Description

13.4.3 Products and Services

13.4.4 Financial Overview

13.4.5 SWOT Analysis

13.4.6 Key Developments

12.5 FUJIFILM Holdings Corp

13.5.1 Key Facts

13.5.2 Business Description

13.5.3 Products and Services

13.5.4 Financial Overview

13.5.5 SWOT Analysis

13.5.6 Key Developments

12.6 Amkor Technology Inc

13.6.1 Key Facts

13.6.2 Business Description

13.6.3 Products and Services

13.6.4 Financial Overview

13.6.5 SWOT Analysis

13.6.6 Key Developments

12.7 ASE Technology Holding Co Ltd

13.7.1 Key Facts

13.7.2 Business Description

13.7.3 Products and Services

13.7.4 Financial Overview

13.7.5 SWOT Analysis

13.7.6 Key Developments

12.8 NXP Semiconductors NV

13.8.1 Key Facts

13.8.2 Business Description

13.8.3 Products and Services

13.8.4 Financial Overview

13.8.5 SWOT Analysis

13.8.6 Key Developments

12.9 JCET Group Co Ltd

13.9.1 Key Facts

13.9.2 Business Description

13.9.3 Products and Services

13.9.4 Financial Overview

13.9.5 SWOT Analysis

13.9.6 Key Developments

12.10 Shin-Etsu Chemical Co Ltd

13.10.1 Key Facts

13.10.2 Business Description

13.10.3 Products and Services

13.10.4 Financial Overview

13.10.5 SWOT Analysis

13.10.6 Key Developments

13. Appendix

List of Tables

Table 1. Asia Pacific Redistribution Layer Material Market Segmentation

Table 2. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Table 3. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Table 4. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type

Table 5. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type

Table 6. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application

Table 7. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 8. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 9. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 10. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 11. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 12. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 13. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 14. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 15. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 16. South Korea Redistribution Layer Material Market Revenue and Forecasts To 2030 (Kilo Ton) - By Type

Table 17. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 18. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 19. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 20. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 21. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 22. Company Positioning & Concentration

List of Figures

Figure 1. Asia Pacific Redistribution Layer Material Market Segmentation, By Country

Figure 2. Porter's Five Forces Analysis

Figure 3. Ecosystem: Asia Pacific Redistribution Layer Material Market

Figure 4. Market Dynamics: Asia Pacific Redistribution Layer Material Market

Figure 5. Asia Pacific Redistribution Layer Material Market Impact Analysis of Drivers and Restraints

Figure 6. Asia Pacific Redistribution Layer Material Market Volume (Tons), 2020 - 2030

Figure 7. Asia Pacific Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030

Figure 8. Asia Pacific Redistribution Layer Material Market Share (%) - Type, 2022 and 2030

Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)

Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)

Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)

Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 15. Others Market Volume and Forecasts To 2030 (Tons)

Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 17. Asia Pacific Redistribution Layer Material Market Share (%) - Application, 2022 and 2030

Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)

Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)

Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 24. Asia Pacific Redistribution Layer Material Market Breakdown by Key Countries, (2022) (US$ Million)

Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)

Figure 26. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 27. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 28. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 29. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 30. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 31. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 32. South Korea Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 33. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 34. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 35. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 36. Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 37. Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 38. Redistribution Layer Material Market Breakdown by Type (2022 and 2030)

Figure 39. Heat Map Analysis by Key Players

1. SK Hynix Inc

2. Samsung Electronics Co Ltd

3. Infineon Technologies AG

4. DuPont de Nemours Inc

5. FUJIFILM Holdings Corp

6. Amkor Technology Inc

7. ASE Technology Holding Co Ltd

8. NXP Semiconductors NV

9. JCET Group Co Ltd

10. Shin-Etsu Chemical Co Ltd

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the Asia Pacific redistribution layer material market.
Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in Asia Pacific redistribution layer material market, thereby allowing players across the value chain to develop effective long-term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth Asia Pacific market trends and outlook coupled with the factors driving the redistribution layer material market, as well as those hindering it.
Enhance the decision-making process by understanding the strategies that underpin security interest with respect to client products, segmentation, pricing, and distribution.

Report Code
Full Name
Country Name
Email Id
Phone Number
Job Title
Company
Requirement
Note : Your data will never be shared with third parties, however, we may send you information from time to time about our products that may be of interest to you. By submitting your details, you agree to be contacted by us. You may contact us at any time to opt-out.

Related Reports

Report Name	Published Date
Asia Pacific Wind Turbine Condition Monitoring Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Component (Hardware, and Software an..	May 2022
Asia Pacific Automotive System Simulation Software Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Type (Transmission, Engine, Elec..	May 2022
Asia Pacific Ground Engaging Tools Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Application (Excavators, Loaders, Bulldozers, an..	May 2022

Purchase Options

Single User License

$3550

$2840

Site License

$4550

$3640

Enterprise License

$5550

$4440

GET FREE SAMPLE PDF

Inquire before Buying Inquire for Discount

Subscription Member Price: FREE

Get Subscription

Sample PDF showcases the content structure and the nature of the information included in the report which presents a qualitative and quantitative analysis.

Request for Free Sample